Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding

T. Yokoshima; Y. Yamaji; N. Igawa; K. Kikuchi; H. Nakagawa; M. Aoyagi

doi:10.1149/1.3115653

Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding

T. Yokoshima^*, Y. Yamaji, N. Igawa, K. Kikuchi, H. Nakagawa, M. Aoyagi

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Deposition behavior of localized electroless NiB deposition for pad-to-pad connection was investigated. Localized deposition occurred mainly on the area between facing pads, and anisotropic deposition toward each facing pad was obtained. Thus, this connection, "preferential bridge connection", is no need of photolithographic technique. These results indicated that this process is one of the maskless fabrication processes. Moreover, chemical flip-chip bonding containing preferential bridge interconnection was demonstrated. The chip-to-substrate interconnection with 30 μm pitch was successfully achieved.

Original language	English
Title of host publication	ECS Transactions - Electronics Packaging 3 - 214th ECS Meeting
Pages	77-85
Number of pages	9
Edition	22
DOIs	https://doi.org/10.1149/1.3115653
Publication status	Published - 2009 Nov 23
Externally published	Yes
Event	Electronics Packaging 3 - 214th ECS Meeting - Honolulu, HI, United States Duration: 2008 Oct 12 → 2008 Oct 17

Publication series

Name	ECS Transactions
Number	22
Volume	16
ISSN (Print)	1938-5862
ISSN (Electronic)	1938-6737

Conference

Conference	Electronics Packaging 3 - 214th ECS Meeting
Country/Territory	United States
City	Honolulu, HI
Period	08/10/12 → 08/10/17

ASJC Scopus subject areas

Engineering(all)

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10.1149/1.3115653

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Yokoshima, T., Yamaji, Y., Igawa, N., Kikuchi, K., Nakagawa, H., & Aoyagi, M. (2009). Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding. In ECS Transactions - Electronics Packaging 3 - 214th ECS Meeting (22 ed., pp. 77-85). (ECS Transactions; Vol. 16, No. 22). https://doi.org/10.1149/1.3115653

Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding. / Yokoshima, T.; Yamaji, Y.; Igawa, N. et al.
ECS Transactions - Electronics Packaging 3 - 214th ECS Meeting. 22. ed. 2009. p. 77-85 (ECS Transactions; Vol. 16, No. 22).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yokoshima, T, Yamaji, Y, Igawa, N, Kikuchi, K, Nakagawa, H & Aoyagi, M 2009, Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding. in ECS Transactions - Electronics Packaging 3 - 214th ECS Meeting. 22 edn, ECS Transactions, no. 22, vol. 16, pp. 77-85, Electronics Packaging 3 - 214th ECS Meeting, Honolulu, HI, United States, 08/10/12. https://doi.org/10.1149/1.3115653

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AU - Nakagawa, H.

AU - Aoyagi, M.

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N2 - Deposition behavior of localized electroless NiB deposition for pad-to-pad connection was investigated. Localized deposition occurred mainly on the area between facing pads, and anisotropic deposition toward each facing pad was obtained. Thus, this connection, "preferential bridge connection", is no need of photolithographic technique. These results indicated that this process is one of the maskless fabrication processes. Moreover, chemical flip-chip bonding containing preferential bridge interconnection was demonstrated. The chip-to-substrate interconnection with 30 μm pitch was successfully achieved.

AB - Deposition behavior of localized electroless NiB deposition for pad-to-pad connection was investigated. Localized deposition occurred mainly on the area between facing pads, and anisotropic deposition toward each facing pad was obtained. Thus, this connection, "preferential bridge connection", is no need of photolithographic technique. These results indicated that this process is one of the maskless fabrication processes. Moreover, chemical flip-chip bonding containing preferential bridge interconnection was demonstrated. The chip-to-substrate interconnection with 30 μm pitch was successfully achieved.

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Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding

Abstract

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