Mechanical Properties of a Partially Solidified Cu-Zn Alloy

Naoki Kasuya, Tomoaki Nakazawa, Akira Matsushita*, Toshimitsu Okane, Makoto Yoshida

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)


For predicting solidification cracking by thermal stress analysis, the mechanical properties in the partially solidified state based on the experimental results are the best hope. However, the Young’s modulus has never been investigated for copper alloys. In this study, stress–strain curves of a Cu-Zn alloy in the partially solidified state for various solid fractions were obtained using a specially developed horizontal tensile test device. Furthermore, by removing the load during the tensile test, the spring-back (elastic behavior) was observed and the Young’s modulus was obtained.

Original languageEnglish
Pages (from-to)1661-1667
Number of pages7
JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Issue number4
Publication statusPublished - 2016 Apr 1

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys


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