TY - JOUR
T1 - Mechanics of direct bonding
T2 - Splitting forces
AU - Zimin, Y.
AU - Ueda, T.
AU - Tatsumi, K.
N1 - Funding Information:
This work is based on results obtained from a project commissioned by the New Energy and Industrial Technology Development Organization (NEDO) . The authors would like to thank Elsevier Language Services for language editing and Illustration Services for illustrations preparation. Zimin Yury was born in Minsk, Belarus, on July 18, 1978. He received B.E. degree in Physics of Semiconductors and Nano Electronics from Belarusian State University, Minsk, Belarus, in 2004. He received M.E. degree in Brain science from Graduate School of Life Science and Engineering, Institute of Technology, Kyushu, Japan, in 2006. He is now enrolled in Graduate School of Information, Production and Systems, Waseda University as a Ph.D. student Toshitsugu Ueda was born in Nara, Japan, on October 4, 1945. He received B.E. and M.E. degrees in electrical engineering from Shinshu University, Nagano, Japan, in 1969 and 1971, respectively. He received a Ph.D. from Tokyo Institute of Technology in 1988. Since joining Yokogawa Electric Corporation in 1971, he has been engaged in developing low noise amplifiers, mechanical resonators, micro machining technologies, and sensors using these technologies to control temperature, pressure and displacement. He is currently a professor at Waseda University. He received awards from the Society of Instrument and Control Engineers (Japan)in 1987 and 1994, plus the Japan Institute of Invention and Innovation in 1985 and 1987. Dr. Ueda is a member of the Institute of Electrical Engineers (Japan), plus the Society of Instrument and Control Engineers (Japan). Kohei TATSUMI (‘1953) He received the Dr. Ing. degree in physical metallurgy from Technische Hochschule Aachen, Germany in 1983. Since 2010 he has been a professor at graduate school of IPS, Waseda University. His research interests cover the area of electronic materials, including SiC crystals for power devices, high temperature resistant packaging, polymer composite and nano size particles. He is a member of the JIM, JIEP, JSAP, IEEE and IMAPS.
Publisher Copyright:
© 2019
PY - 2020/3/1
Y1 - 2020/3/1
N2 - The bonding strength between dissimilar materials depends heavily on internal stresses, which arise due to the differences in the thermal expansion coefficients of the materials. While the existing models describe the splitting forces near the edges of the structure, those in the main part of the structure remote from the edges, where the stresses are uniformly distributed along the interface, have not been calculated yet. This study attempts to fill this knowledge gap in the mechanics of bonded structures. Herein, we propose a model that allows the calculation of the splitting forces in the basic part of the bonded bilayer where the internal stresses along interface are uniformly distributed. The calculations reveal three possible distributions of the splitting forces in the bonded structure, i.e., the splitting forces could be either located at the center or the periphery—which also includes the edges of the structure, or could be completely absent regardless of the total magnitude of the residual stresses. The results obtained could be used in bonding technology as an immediate guide to increasing the bonding strength between dissimilar materials.
AB - The bonding strength between dissimilar materials depends heavily on internal stresses, which arise due to the differences in the thermal expansion coefficients of the materials. While the existing models describe the splitting forces near the edges of the structure, those in the main part of the structure remote from the edges, where the stresses are uniformly distributed along the interface, have not been calculated yet. This study attempts to fill this knowledge gap in the mechanics of bonded structures. Herein, we propose a model that allows the calculation of the splitting forces in the basic part of the bonded bilayer where the internal stresses along interface are uniformly distributed. The calculations reveal three possible distributions of the splitting forces in the bonded structure, i.e., the splitting forces could be either located at the center or the periphery—which also includes the edges of the structure, or could be completely absent regardless of the total magnitude of the residual stresses. The results obtained could be used in bonding technology as an immediate guide to increasing the bonding strength between dissimilar materials.
KW - Direct bonding
KW - Splitting forces
KW - Strain energy
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U2 - 10.1016/j.sna.2019.111671
DO - 10.1016/j.sna.2019.111671
M3 - Article
AN - SCOPUS:85075334309
SN - 0924-4247
VL - 303
JO - Sensors and Actuators, A: Physical
JF - Sensors and Actuators, A: Physical
M1 - 111671
ER -