Mechanism of low temperature sintering-bonding through in-situ formation of silver nanoparticles using silver oxide microparticles

Fengwen Mu; Zhenyu Zhao; Guisheng Zou; Hailin Bai; Aiping Wu; Lei Liu; Dongyue Zhang; Y. Norman Zhou

doi:10.2320/matertrans.MD201231

Mechanism of low temperature sintering-bonding through in-situ formation of silver nanoparticles using silver oxide microparticles

Fengwen Mu, Zhenyu Zhao, Guisheng Zou, Hailin Bai, Aiping Wu, Lei Liu, Dongyue Zhang, Y. Norman Zhou

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

Abstract

In this paper, a low temperature sintering-bonding process through in-situ formation of silver (Ag) nanoparticles using silveroxide (Ag₂O) microparticles was studied. The Ag₂O powders were mixed with triethylene glycol (TEG) to form a paste, which was used to bond the Ag-coated copper (Cu) bulks. The results revealed that high temperature was helpful to increase the bond strength, and the joints average shear strength can reach 21.9MPa at 523K under 2 MPa for 5 min. And the mechanism of the reaction and sintering bonding process were basically made clear by using TGA-FTIR, FE-SEM and XRD, further, a reasonable sintering-bonding model was proposed.

Original language	English
Pages (from-to)	872-878
Number of pages	7
Journal	Materials Transactions
Volume	54
Issue number	6
DOIs	https://doi.org/10.2320/matertrans.MD201231
Publication status	Published - 2013 Jun 18
Externally published	Yes

Keywords

In-situ formation
Mechanism
Silver oxide
Sintering-bonding

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.2320/matertrans.MD201231

Cite this

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title = "Mechanism of low temperature sintering-bonding through in-situ formation of silver nanoparticles using silver oxide microparticles",

abstract = "In this paper, a low temperature sintering-bonding process through in-situ formation of silver (Ag) nanoparticles using silveroxide (Ag2O) microparticles was studied. The Ag2O powders were mixed with triethylene glycol (TEG) to form a paste, which was used to bond the Ag-coated copper (Cu) bulks. The results revealed that high temperature was helpful to increase the bond strength, and the joints average shear strength can reach 21.9MPa at 523K under 2 MPa for 5 min. And the mechanism of the reaction and sintering bonding process were basically made clear by using TGA-FTIR, FE-SEM and XRD, further, a reasonable sintering-bonding model was proposed.",

keywords = "In-situ formation, Mechanism, Silver oxide, Sintering-bonding",

author = "Fengwen Mu and Zhenyu Zhao and Guisheng Zou and Hailin Bai and Aiping Wu and Lei Liu and Dongyue Zhang and {Norman Zhou}, Y.",

year = "2013",

month = jun,

day = "18",

doi = "10.2320/matertrans.MD201231",

language = "English",

volume = "54",

pages = "872--878",

journal = "Materials Transactions",

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publisher = "Japan Institute of Metals (JIM)",

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T1 - Mechanism of low temperature sintering-bonding through in-situ formation of silver nanoparticles using silver oxide microparticles

AU - Mu, Fengwen

AU - Zhao, Zhenyu

AU - Zou, Guisheng

AU - Bai, Hailin

AU - Wu, Aiping

AU - Liu, Lei

AU - Zhang, Dongyue

AU - Norman Zhou, Y.

PY - 2013/6/18

Y1 - 2013/6/18

N2 - In this paper, a low temperature sintering-bonding process through in-situ formation of silver (Ag) nanoparticles using silveroxide (Ag2O) microparticles was studied. The Ag2O powders were mixed with triethylene glycol (TEG) to form a paste, which was used to bond the Ag-coated copper (Cu) bulks. The results revealed that high temperature was helpful to increase the bond strength, and the joints average shear strength can reach 21.9MPa at 523K under 2 MPa for 5 min. And the mechanism of the reaction and sintering bonding process were basically made clear by using TGA-FTIR, FE-SEM and XRD, further, a reasonable sintering-bonding model was proposed.

AB - In this paper, a low temperature sintering-bonding process through in-situ formation of silver (Ag) nanoparticles using silveroxide (Ag2O) microparticles was studied. The Ag2O powders were mixed with triethylene glycol (TEG) to form a paste, which was used to bond the Ag-coated copper (Cu) bulks. The results revealed that high temperature was helpful to increase the bond strength, and the joints average shear strength can reach 21.9MPa at 523K under 2 MPa for 5 min. And the mechanism of the reaction and sintering bonding process were basically made clear by using TGA-FTIR, FE-SEM and XRD, further, a reasonable sintering-bonding model was proposed.

KW - In-situ formation

KW - Mechanism

KW - Silver oxide

KW - Sintering-bonding

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JF - Materials Transactions

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Mechanism of low temperature sintering-bonding through in-situ formation of silver nanoparticles using silver oxide microparticles

Abstract

Keywords

ASJC Scopus subject areas

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