Micro-ball bump technology for fine-pitch interconnections

Kenji Shimokawa*, Kohei Tatsumi, Eiji Hashino, Yoshio Ohzeki, Masashi Konda, Youji Kawakami

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

6 Citations (Scopus)


Micro-ball bump technology has been developed for high density flip chip (FC) interconnections of high performance LSI chips. This technology consists of (1) the production method of fine metal balls (micro-balls) with high accuracy in size and good sphericity in shape and (2) the gang-bonding method of the micro-balls on the electrodes of chips in order to form bumps (micro-ball bumps) for FC interconnections. Gold or solder balls of 35-150 μm in diameter were prepared. After holding the balls on the through-holes of an arrangement plate by a vacuum suction method, the micro-balls are bonded onto the electrodes of the chips. Using an originally developed micro-ball mounter, the balls are successfully arranged on the arrangement plate without excess and lack of balls. The micro-gold bumps of 35 μm in size can be formed with 50 μm pitch or less.

Original languageEnglish
Number of pages5
Publication statusPublished - 1997
Externally publishedYes
EventProceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium - Tokyo, Jpn
Duration: 1997 Apr 161997 Apr 18


OtherProceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium
CityTokyo, Jpn

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering


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