Micro-ball wafer bumping for flip chip interconnection

A new wafer bumping method using micro-balls was developed that can be used for high-density LSI assembly, specifically for Flip Chip interconnection. Micro solder balls with the diameter ranging from 60 μm to 200 μm were first formed with a high level of accuracy and sphericity. These balls were transferred and bonded to the whole electrode-pads of an 8-inch wafer in one stroke using a fully automated micro ball mounter, which was newly developed. The balls were held on fluxed pads and melted in a reflow furnace. The fluxing was performed using unique stamp system. The productivity and the yield were evaluated under the following conditions. The number of chips on an 8 inch wafer was 616, Pad pitch was 250 μm, Pad number of a chip was 625 (25×25 area array), and the total number of balls on a wafer was 385,000. The yield of forming bumps was confirmed to be higher than 99.995% without repairing and the cycle time of micro ball bumping was ca. 5 min. For an 8 inch wafer. The bump height variation, the bump shear strength and the bond reliability were evaluated in comparison with other methods.