TY - GEN
T1 - Micro-cone-shaped Au-bump by gas deposition method for high-density interconnection of LSI chips
AU - Imura, Fumito
AU - Nakagawa, Hiroshi
AU - Kikuchi, Katsuya
AU - Yamaji, Yasuhiro
AU - Yokoshima, Tokihiko
AU - Aoyagi, Masahiro
AU - Baba, So
AU - Akedo, Jun
PY - 2008/12/1
Y1 - 2008/12/1
N2 - The technology of bump connections with high-density and reliability has been developed for 3D packaging of LSI and MEMS devices. A tapered bump has high potential to the bump connections. We focus attention on the formation of the tapered bump with self-forming, simple, and high-throughput process by a photolithography and a gas deposition (GD) method. The thickness photoresist of the holes pattern, which is formed by the photolithography, is used as the mask pattern against the deposition of the Au nanoparticles in the GD method. The deposited Au nanoparticles also horizontally grow so that the shaded mask is gradually formed along edge of the holes pattern, and completely cover in the holes. The micro-cone-shaped Au bump can be automatically formed.
AB - The technology of bump connections with high-density and reliability has been developed for 3D packaging of LSI and MEMS devices. A tapered bump has high potential to the bump connections. We focus attention on the formation of the tapered bump with self-forming, simple, and high-throughput process by a photolithography and a gas deposition (GD) method. The thickness photoresist of the holes pattern, which is formed by the photolithography, is used as the mask pattern against the deposition of the Au nanoparticles in the GD method. The deposited Au nanoparticles also horizontally grow so that the shaded mask is gradually formed along edge of the holes pattern, and completely cover in the holes. The micro-cone-shaped Au bump can be automatically formed.
KW - Au bump
KW - Bonding
KW - Bump connection
KW - Cone bump
KW - Gas deposition (GD) method
KW - Three-dimensional (3D) packaging technology
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M3 - Conference contribution
AN - SCOPUS:84879761496
SN - 9781615673339
T3 - 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008
SP - 269
EP - 271
BT - 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008
T2 - 4th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2008
Y2 - 21 April 2008 through 24 April 2008
ER -