Micro flow devices

Shuichi Shoji; Masayoshi Esashi

Micro flow devices

Shuichi Shoji^*, Masayoshi Esashi

^*Corresponding author for this work

School of Fundamental Science and Engineering

Research output: Contribution to conference › Paper › peer-review

10 Citations (Scopus)

Abstract

Micro flow devices of microvalves, micropumps developed very recently are introduced from the point of view of the actuating principle. Since such micro flow devices have multi-level stack structures of the wafers, the bonding methods play a very important role in the fabrication. The silicon-to-glass and the silicon-to-silicon anodic bonding methods using a sputtered Pyrex glass intermediate layer were studied to realize multi-level stacks. A time-of-flight type flow sensor was fabricated and tested.

Original language	English
Pages	89-95
Number of pages	7
Publication status	Published - 1994 Dec 1
Event	Proceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings - Nagoya, Jpn Duration: 1994 Oct 2 → 1994 Oct 4

Other

Other	Proceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings
City	Nagoya, Jpn
Period	94/10/2 → 94/10/4

ASJC Scopus subject areas

Mechanical Engineering

Cite this

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title = "Micro flow devices",

abstract = "Micro flow devices of microvalves, micropumps developed very recently are introduced from the point of view of the actuating principle. Since such micro flow devices have multi-level stack structures of the wafers, the bonding methods play a very important role in the fabrication. The silicon-to-glass and the silicon-to-silicon anodic bonding methods using a sputtered Pyrex glass intermediate layer were studied to realize multi-level stacks. A time-of-flight type flow sensor was fabricated and tested.",

author = "Shuichi Shoji and Masayoshi Esashi",

year = "1994",

month = dec,

day = "1",

language = "English",

pages = "89--95",

note = "Proceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings ; Conference date: 02-10-1994 Through 04-10-1994",

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TY - CONF

T1 - Micro flow devices

AU - Shoji, Shuichi

AU - Esashi, Masayoshi

PY - 1994/12/1

Y1 - 1994/12/1

N2 - Micro flow devices of microvalves, micropumps developed very recently are introduced from the point of view of the actuating principle. Since such micro flow devices have multi-level stack structures of the wafers, the bonding methods play a very important role in the fabrication. The silicon-to-glass and the silicon-to-silicon anodic bonding methods using a sputtered Pyrex glass intermediate layer were studied to realize multi-level stacks. A time-of-flight type flow sensor was fabricated and tested.

AB - Micro flow devices of microvalves, micropumps developed very recently are introduced from the point of view of the actuating principle. Since such micro flow devices have multi-level stack structures of the wafers, the bonding methods play a very important role in the fabrication. The silicon-to-glass and the silicon-to-silicon anodic bonding methods using a sputtered Pyrex glass intermediate layer were studied to realize multi-level stacks. A time-of-flight type flow sensor was fabricated and tested.

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M3 - Paper

AN - SCOPUS:0028758641

SP - 89

EP - 95

T2 - Proceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings

Y2 - 2 October 1994 through 4 October 1994

ER -

Micro flow devices

Abstract

Other

ASJC Scopus subject areas

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