Microbubble formation from ionic vacancies in copper electrodeposition under a high magnetic field

Makoto Miura*, Ryoichi Aogaki, Yoshinobu Oshikiri, Atsushi Sugiyama, Ryoichi Morimoto, Miki Miura, Iwao Mogi, Yusuke Yamauchi

*Corresponding author for this work

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Material Science

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