TY - GEN
T1 - Microfluidic Electrogenerated Chemiluminescenece Device Using a Wide-Energy-Gap Material
AU - Ichinohe, Nanami
AU - Ishimatsu, Ryoichi
AU - Mizuno, Jun
AU - Kasahara, Takashi
N1 - Funding Information:
ACKNOWLEDEMENT The authors would like to acknowledge Mr. Takuma Umezawa (Hosei University) for fruitful discussions. This research was supported by JSPS KAKENHI Grant Number JP21K14170.
Publisher Copyright:
© 2022 Japan Institute of Electronics Packaging.
PY - 2022
Y1 - 2022
N2 - We propose a near ultraviolet electrogenerated chemiluminescence (NUV-ECL) device using a fluorene derivative, 2,7-bis(9,9'-spirobifluorene-2-yl)-9,9'-spirobifluorene (TSBF). The ECL solution was prepared by dissolving TSBF, which emits light at a maximum photoluminescence wavelength of 396 nm, in a mixed organic solvent. The microfluidic ECL device successfully exhibited the ECL emission from the TSBF molecule. We expect that the proposed wide-energy-gap ECL solution can be used as the host for highly luminescent ECL display devices.
AB - We propose a near ultraviolet electrogenerated chemiluminescence (NUV-ECL) device using a fluorene derivative, 2,7-bis(9,9'-spirobifluorene-2-yl)-9,9'-spirobifluorene (TSBF). The ECL solution was prepared by dissolving TSBF, which emits light at a maximum photoluminescence wavelength of 396 nm, in a mixed organic solvent. The microfluidic ECL device successfully exhibited the ECL emission from the TSBF molecule. We expect that the proposed wide-energy-gap ECL solution can be used as the host for highly luminescent ECL display devices.
KW - Electrogenerated chemiluminescence
KW - MEMS microfluidic device
KW - Near ultraviolet
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U2 - 10.23919/ICEP55381.2022.9795646
DO - 10.23919/ICEP55381.2022.9795646
M3 - Conference contribution
AN - SCOPUS:85133320516
T3 - 2022 International Conference on Electronics Packaging, ICEP 2022
SP - 21
EP - 22
BT - 2022 International Conference on Electronics Packaging, ICEP 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Electronics Packaging, ICEP 2022
Y2 - 11 May 2022 through 14 May 2022
ER -