TY - GEN
T1 - Morphology Control of Cu Added Electrodeposited Bi-Sb-Te Thick Films for Micro-Thermoelectric Devices
AU - Chen, Chuyi
AU - Saito, Mikiko
AU - Homma, Takayuki
N1 - Funding Information:
A part of this study was supported by the Nanotechnology Platform Project sponsored by MEXT, Japan.
Publisher Copyright:
© 2020 ECS - The Electrochemical Society.
PY - 2020/4/1
Y1 - 2020/4/1
N2 - In this research, bismuth and tellurium based thermoelectric materials are studied and electrodeposition method was adapted to fabricate the devices. To improve the thermoelectric performance, the thickness of the patterned films was attempted to be increased up to 30 μm. Film properties, such as morphology, composition, resistivity and thermoelectric output, of p-type Cu-added Bi-Sb-Te films were investigated. It was found that the thermoelectric properties were improved with an increase in the film thickness. An annealed buffer layer was created as substrate to control the morphology of Bi-Sb-Te films to be more compact and denser. Finally, 30 μm thick p-type Bi-Sb-Te patterned-films were successfully fabricated, indicating the applicability to micro-thermoelectric devices.
AB - In this research, bismuth and tellurium based thermoelectric materials are studied and electrodeposition method was adapted to fabricate the devices. To improve the thermoelectric performance, the thickness of the patterned films was attempted to be increased up to 30 μm. Film properties, such as morphology, composition, resistivity and thermoelectric output, of p-type Cu-added Bi-Sb-Te films were investigated. It was found that the thermoelectric properties were improved with an increase in the film thickness. An annealed buffer layer was created as substrate to control the morphology of Bi-Sb-Te films to be more compact and denser. Finally, 30 μm thick p-type Bi-Sb-Te patterned-films were successfully fabricated, indicating the applicability to micro-thermoelectric devices.
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U2 - 10.1149/09707.0877ecst
DO - 10.1149/09707.0877ecst
M3 - Conference contribution
AN - SCOPUS:85089807912
T3 - ECS Transactions
SP - 877
EP - 883
BT - Selected Proceedings from the 237th ECS Meeting with the 18th International Meeting on Chemical Sensors, IMCS 2020
PB - IOP Publishing Ltd.
T2 - 237th ECS Meeting with the 18th International Meeting on Chemical Sensors, IMCS 2020
Y2 - 10 May 2020 through 14 May 2020
ER -