Multi-layer floorplanning for stacked ICs: Configuration number and fixed-outline constraints

Song Chen*, Takeshi Yoshimura

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

22 Citations (Scopus)


3-D (stacked device layers) ICs can significantly alleviate the interconnect problem coming with the decreasing feature size and is promising for heterogeneous integration. In this paper, we concentrate on the configuration number and fixed-outline constraints in the floorplanning for 3-D ICs. Extended sequence pair, named partitioned sequence pair (in short, P-SP), is used to represent 3-D IC floorplans. We prove that the number of configuration of 3-D IC floorplans represented by P-SP is less than that of planar floorplans represented by sequence pair (SP) and decreases as the device layer number increases. Moreover, we applied the technique of block position enumeration, which have been successfully used in planar fixed-outline floorplanning, to fixed-outline multi-layer floorplanning. The experimental results demonstrate the efficiency and effectiveness of the proposed method.

Original languageEnglish
Pages (from-to)378-388
Number of pages11
JournalIntegration, the VLSI Journal
Issue number4
Publication statusPublished - 2010 Sept


  • 3-D ICs
  • Fixed-outline
  • Floorplanning
  • Sequence pair
  • Through silicon via (TSV)

ASJC Scopus subject areas

  • Hardware and Architecture
  • Software
  • Electrical and Electronic Engineering

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