Multi-Objective Design Optimization of Power Module Performances

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

As next-generation power modules develop with three-dimensional wiring structures and high-speed switching schemes, strategies to reduce the parasitic inductance and temperature will be essential to meet the increasingly demanding workloads. In this study, we developed a multi-objective design optimization system for power modules and rendered Pareto solutions outlining the inductance of the path between the main terminals, the total inductance of the paths between the control terminals, and the surface temperature of the path between the main terminals, being useful to design power modules with utmost thermal and inductance performance.

Original languageEnglish
Title of host publication2022 International Conference on Electronics Packaging, ICEP 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages157-158
Number of pages2
ISBN (Electronic)9784991191138
DOIs
Publication statusPublished - 2022
Event21st International Conference on Electronics Packaging, ICEP 2022 - Sapporo, Japan
Duration: 2022 May 112022 May 14

Publication series

Name2022 International Conference on Electronics Packaging, ICEP 2022

Conference

Conference21st International Conference on Electronics Packaging, ICEP 2022
Country/TerritoryJapan
CitySapporo
Period22/5/1122/5/14

Keywords

  • inductance
  • multi-objective design optimization
  • power module
  • switching loss
  • temperature

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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