TY - GEN
T1 - Nano-Artifact Metrics Chip Mounting Technology for Edge AI Device Security
AU - Masago, Hitoshi
AU - Nodaka, Hiro
AU - Kishimoto, Kazuma
AU - Kawai, Alaric Yohei
AU - Shoji, Shuichi
AU - Mizuno, Jun
N1 - Funding Information:
The authors would like to thank K. Sumiya, affiliated with the National Institute of Advanced Industrial Science and Technology (AIST), and M. Houga, formerly of AIST, for their support and guidance throughout this research. This paper is based on results obtained from a project, JPNP16007, commissioned by the New Energy and Industrial Technology Development Organization (NEDO).
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - In this study, the effect of surface treatment on the boding strength between Quad flat package (QFP) and quartz was investigated for establishing a QFP/quartz glass bonding technique. This bonding technique is necessary to prevent bond failure at the nano-artifact metrics (NAM) chip and adhesive interface against physical attacks such as counterfeiting and tampering of edge AI devices that use NAM chips. Therefore, we investigated the relationship between surface roughness and tensile strength by applying surface treatments such as vacuum ultraviolet (VUV) and Ar/O2 plasma. All QFP/quartz glass with surface treatments such as VUV and Ar/O2 plasma showed increased bond strength. Surface treatment and bonding technology for QFP and quartz glass were established to realize NAM chip mounting.
AB - In this study, the effect of surface treatment on the boding strength between Quad flat package (QFP) and quartz was investigated for establishing a QFP/quartz glass bonding technique. This bonding technique is necessary to prevent bond failure at the nano-artifact metrics (NAM) chip and adhesive interface against physical attacks such as counterfeiting and tampering of edge AI devices that use NAM chips. Therefore, we investigated the relationship between surface roughness and tensile strength by applying surface treatments such as vacuum ultraviolet (VUV) and Ar/O2 plasma. All QFP/quartz glass with surface treatments such as VUV and Ar/O2 plasma showed increased bond strength. Surface treatment and bonding technology for QFP and quartz glass were established to realize NAM chip mounting.
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U2 - 10.1109/IMPACT56280.2022.9966672
DO - 10.1109/IMPACT56280.2022.9966672
M3 - Conference contribution
AN - SCOPUS:85144076877
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
BT - Proceedings - 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022
PB - IEEE Computer Society
T2 - 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022
Y2 - 26 October 2022 through 28 October 2022
ER -