@inproceedings{e2339c9416e64c888b578cb57967a447,
title = "Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature",
abstract = "A low temperature all-Cu bonding via the sintering of nano-Cu paste in Pt-catalyzed formic acid vapor was studied, which was demonstrated with a large tolerance of surface oxidation. The bonding strength of oxidized-Cu to Cu could be significantly improved via the treatment of Pt-catalyzed formic acid vapor. The interfacial analysis was carried out to understand the mechanisms.",
keywords = "bonding, interface, low temperature, Nano-Cu paste, Pt-catalyzed formic acid, sintering",
author = "Fengwen Mu and Hui Ren and Lei Liu and Yinghui Wang and Guisheng Zou and Tadatomo Suga",
year = "2019",
month = apr,
day = "1",
doi = "10.23919/ICEP.2019.8733407",
language = "English",
series = "2019 International Conference on Electronics Packaging, ICEP 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "365--366",
booktitle = "2019 International Conference on Electronics Packaging, ICEP 2019",
note = "2019 International Conference on Electronics Packaging, ICEP 2019 ; Conference date: 17-04-2019 Through 20-04-2019",
}