TY - GEN
T1 - New interconnect structure design methodology by Layout-design-based Interconnect Structure Optimization System (LADINOS)
AU - Kobayashi, S.
AU - Edahiro, M.
AU - Hayashi, Y.
PY - 2000
Y1 - 2000
N2 - We present here the use of the performance predicting ECAD system, which is called Layout-design-based Interconnect Structure Optimization System (LADINOS), for the optimization of multilayer interconnect structures. This system is intended to be used to redesign current ULSI data on possible interconnect structures in the future and to measure the performance of such redesigned ULSIs. Despite the fact that system procedures include chip-size prediction, timing-driven assignment of interconnects to layers, and RC extraction which takes coupling capacitance into account, these procedures are performed very fast. We also give an example of the optimization of multi-layer interconnect structures for use in 0.13 μm-generation ULSIs with Al-interconnects.
AB - We present here the use of the performance predicting ECAD system, which is called Layout-design-based Interconnect Structure Optimization System (LADINOS), for the optimization of multilayer interconnect structures. This system is intended to be used to redesign current ULSI data on possible interconnect structures in the future and to measure the performance of such redesigned ULSIs. Despite the fact that system procedures include chip-size prediction, timing-driven assignment of interconnects to layers, and RC extraction which takes coupling capacitance into account, these procedures are performed very fast. We also give an example of the optimization of multi-layer interconnect structures for use in 0.13 μm-generation ULSIs with Al-interconnects.
UR - http://www.scopus.com/inward/record.url?scp=84962866752&partnerID=8YFLogxK
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U2 - 10.1109/IITC.2000.854266
DO - 10.1109/IITC.2000.854266
M3 - Conference contribution
AN - SCOPUS:84962866752
T3 - Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000
SP - 12
EP - 14
BT - Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd IEEE International Interconnect Technology Conference, IITC 2000
Y2 - 5 June 2000 through 7 June 2000
ER -