News from Japan

Y. Ohki*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review


Development of an Insulated Metal Substrate with High Thermal Conductivity The history of electronic devices is, at least partly, a history of increasingly dense assembly of their component circuits and elements, e.g., resistors, inductors, and capacitors. Nowadays, the speed of densification is even faster. Many technological innovations have been needed to overcome problems arising from such densification. One such problem is the increase in heat generated by circuit elements. If electronic circuits are densely assembled on a printed circuit board (PCB), the generation of heat may cause unexpectedly high temperatures at many places on the board. Consequently, substrates for PCBs must have high thermal conductivity to ensure fast heat dissipation.

Original languageEnglish
Article number7956637
Pages (from-to)67-69
Number of pages3
JournalIEEE Electrical Insulation Magazine
Issue number4
Publication statusPublished - 2017 Jul 1
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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