Development of an Insulated Metal Substrate with High Thermal Conductivity The history of electronic devices is, at least partly, a history of increasingly dense assembly of their component circuits and elements, e.g., resistors, inductors, and capacitors. Nowadays, the speed of densification is even faster. Many technological innovations have been needed to overcome problems arising from such densification. One such problem is the increase in heat generated by circuit elements. If electronic circuits are densely assembled on a printed circuit board (PCB), the generation of heat may cause unexpectedly high temperatures at many places on the board. Consequently, substrates for PCBs must have high thermal conductivity to ensure fast heat dissipation.
|Number of pages||3|
|Journal||IEEE Electrical Insulation Magazine|
|Publication status||Published - 2017 Jul 1|
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering