Novel flip-chip bonding technology using chemical process

Yasuhiro Yamaji; Tokihiko Yokoshima; Hirotaka Oosato; Noboru Igawa; Yuichiro Tamura; Katsuya Kikuchi; Hiroshi Nakagawa; Masahiro Aoyagi

doi:10.1109/ECTC.2007.373905

Novel flip-chip bonding technology using chemical process

Yasuhiro Yamaji^*, Tokihiko Yokoshima, Hirotaka Oosato, Noboru Igawa, Yuichiro Tamura, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Citations (Scopus)

Abstract

Reductions of bonding temperature and bonding pressure are regarded as key challenges for higher interconnection-density packages in recent years. To avoid negative factors caused by mechanical process such as thermal stress and mechanical damage of the device circuits, we have developed novel flip-chip bonding technology using electroless NiB plating of the chemical process. Bump connection of 2D pattern using electroless NiB plating was realized by controlling extraneous deposition, which is deposited on insulator layer without catalyst. The potential of the novel flip-chip bonding technology using controlled extraneous deposition of the electroless NiB plating was experimentally demonstrated using 20μm-pitch flip-chip test vehicle.

Original language	English
Title of host publication	Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages	898-904
Number of pages	7
DOIs	https://doi.org/10.1109/ECTC.2007.373905
Publication status	Published - 2007 Oct 22
Externally published	Yes
Event	57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States Duration: 2007 May 29 → 2007 Jun 1

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	57th Electronic Components and Technology Conference 2007, ECTC '07
Country/Territory	United States
City	Sparks, NV
Period	07/5/29 → 07/6/1

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2007.373905

Cite this

Yamaji, Y., Yokoshima, T., Oosato, H., Igawa, N., Tamura, Y., Kikuchi, K., Nakagawa, H., & Aoyagi, M. (2007). Novel flip-chip bonding technology using chemical process. In Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07 (pp. 898-904). Article 4249991 (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2007.373905

Novel flip-chip bonding technology using chemical process. / Yamaji, Yasuhiro; Yokoshima, Tokihiko; Oosato, Hirotaka et al.
Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. 2007. p. 898-904 4249991 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yamaji, Y, Yokoshima, T, Oosato, H, Igawa, N, Tamura, Y, Kikuchi, K, Nakagawa, H & Aoyagi, M 2007, Novel flip-chip bonding technology using chemical process. in Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07., 4249991, Proceedings - Electronic Components and Technology Conference, pp. 898-904, 57th Electronic Components and Technology Conference 2007, ECTC '07, Sparks, NV, United States, 07/5/29. https://doi.org/10.1109/ECTC.2007.373905

@inproceedings{eefa5ec2b9434e0baa96ce12a7d55901,

title = "Novel flip-chip bonding technology using chemical process",

abstract = "Reductions of bonding temperature and bonding pressure are regarded as key challenges for higher interconnection-density packages in recent years. To avoid negative factors caused by mechanical process such as thermal stress and mechanical damage of the device circuits, we have developed novel flip-chip bonding technology using electroless NiB plating of the chemical process. Bump connection of 2D pattern using electroless NiB plating was realized by controlling extraneous deposition, which is deposited on insulator layer without catalyst. The potential of the novel flip-chip bonding technology using controlled extraneous deposition of the electroless NiB plating was experimentally demonstrated using 20μm-pitch flip-chip test vehicle.",

author = "Yasuhiro Yamaji and Tokihiko Yokoshima and Hirotaka Oosato and Noboru Igawa and Yuichiro Tamura and Katsuya Kikuchi and Hiroshi Nakagawa and Masahiro Aoyagi",

year = "2007",

month = oct,

day = "22",

doi = "10.1109/ECTC.2007.373905",

language = "English",

isbn = "1424409853",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "898--904",

booktitle = "Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07",

note = "57th Electronic Components and Technology Conference 2007, ECTC '07 ; Conference date: 29-05-2007 Through 01-06-2007",

}

TY - GEN

T1 - Novel flip-chip bonding technology using chemical process

AU - Yamaji, Yasuhiro

AU - Yokoshima, Tokihiko

AU - Oosato, Hirotaka

AU - Igawa, Noboru

AU - Tamura, Yuichiro

AU - Kikuchi, Katsuya

AU - Nakagawa, Hiroshi

AU - Aoyagi, Masahiro

PY - 2007/10/22

Y1 - 2007/10/22

N2 - Reductions of bonding temperature and bonding pressure are regarded as key challenges for higher interconnection-density packages in recent years. To avoid negative factors caused by mechanical process such as thermal stress and mechanical damage of the device circuits, we have developed novel flip-chip bonding technology using electroless NiB plating of the chemical process. Bump connection of 2D pattern using electroless NiB plating was realized by controlling extraneous deposition, which is deposited on insulator layer without catalyst. The potential of the novel flip-chip bonding technology using controlled extraneous deposition of the electroless NiB plating was experimentally demonstrated using 20μm-pitch flip-chip test vehicle.

AB - Reductions of bonding temperature and bonding pressure are regarded as key challenges for higher interconnection-density packages in recent years. To avoid negative factors caused by mechanical process such as thermal stress and mechanical damage of the device circuits, we have developed novel flip-chip bonding technology using electroless NiB plating of the chemical process. Bump connection of 2D pattern using electroless NiB plating was realized by controlling extraneous deposition, which is deposited on insulator layer without catalyst. The potential of the novel flip-chip bonding technology using controlled extraneous deposition of the electroless NiB plating was experimentally demonstrated using 20μm-pitch flip-chip test vehicle.

UR - http://www.scopus.com/inward/record.url?scp=35348890144&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=35348890144&partnerID=8YFLogxK

U2 - 10.1109/ECTC.2007.373905

DO - 10.1109/ECTC.2007.373905

M3 - Conference contribution

AN - SCOPUS:35348890144

SN - 1424409853

SN - 9781424409853

T3 - Proceedings - Electronic Components and Technology Conference

SP - 898

EP - 904

BT - Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07

T2 - 57th Electronic Components and Technology Conference 2007, ECTC '07

Y2 - 29 May 2007 through 1 June 2007

ER -

Novel flip-chip bonding technology using chemical process

Abstract

Publication series

Conference

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this