TY - JOUR
T1 - Novel Pretreatment Process of Critical Metals Bearing E-Scrap By Using Electric Pulse Disintegration
AU - Owada, Shuji
AU - Suzuki, Ryo
AU - Kamata, Yuki
AU - Nakamura, Takashi
N1 - Funding Information:
Acknowledgement This research was financially supported in part under the research project, ‘‘High Efficiency Rare Element Extraction Technology Area’’ organized by the Tohoku University and the Ministry of Education, Culture, Sports, Science and Technology (MEXT). The authors hereby sincerely express their deep gratitude to both the institutions.
Publisher Copyright:
© 2018, The Minerals, Metals & Materials Society.
PY - 2018/6/1
Y1 - 2018/6/1
N2 - Recovering various metals, involving minor rare metals, from electronic devices is important for conserving resources and establishing a sustainable society. This paper describes an economically feasible and radical process for such recovery, especially, for Ta concentration from printed circuit boards (PCBs) which is the two-stage electric pulse disintegration (ED) process. Ta capacitors are detached from the PCBs in the first stage, and the sintered Ta contained within the capacitors is liberated from the capacitor in the second stage. It has been indicated that as much as 100% of Ta capacitors was detached from PCBs in nondestructive form in the first stage of ED and that 95% of sintered Ta and MnO2 phases was liberated from covered plastics, which is much higher than the 46% detachment achieved when using mechanical roll crusher. The detailed detachment and liberation mechanisms of both stages were also described, and an upper limit of the solution’s conductivity in the second-stage ED was indicated.
AB - Recovering various metals, involving minor rare metals, from electronic devices is important for conserving resources and establishing a sustainable society. This paper describes an economically feasible and radical process for such recovery, especially, for Ta concentration from printed circuit boards (PCBs) which is the two-stage electric pulse disintegration (ED) process. Ta capacitors are detached from the PCBs in the first stage, and the sintered Ta contained within the capacitors is liberated from the capacitor in the second stage. It has been indicated that as much as 100% of Ta capacitors was detached from PCBs in nondestructive form in the first stage of ED and that 95% of sintered Ta and MnO2 phases was liberated from covered plastics, which is much higher than the 46% detachment achieved when using mechanical roll crusher. The detailed detachment and liberation mechanisms of both stages were also described, and an upper limit of the solution’s conductivity in the second-stage ED was indicated.
KW - Detachment
KW - Electric pulse disintegration
KW - Liberation
KW - Printed circuit board
KW - Ta capacitor
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U2 - 10.1007/s40831-018-0170-8
DO - 10.1007/s40831-018-0170-8
M3 - Article
AN - SCOPUS:85064182383
SN - 2199-3823
VL - 4
SP - 157
EP - 162
JO - Journal of Sustainable Metallurgy
JF - Journal of Sustainable Metallurgy
IS - 2
ER -