Optimized negative thermal expansion induced by gradual intermetallic charge transfer in Bi1-xSbxNiO3

Takumi Nishikubo, Yuki Sakai, Kengo Oka, Masaichiro Mizumaki, Tetsu Watanuki, Akihiko Machida, Naoyuki Maejima, Shigenori Ueda, Takashi Mizokawa, Masaki Azuma*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)

Abstract

Negative thermal expansion (NTE) induced by intermetallic charge transfer between Bi5+ and Ni2+ was observed in Bi1-xSbxNiO3 (x = 0.05 and 0.10). Bi3+ and Bi5+ had a long-range ordering in the low-temperature phase of Bi0.95Sb0.05NiO3 while the ordering was short-range in Bi0.9Sb0.01NiO3. The latter compound exhibited a continuous NTE with a linear coefficient of thermal expansion (CTE) of αL = %106 ppmK%1 without temperature hysteresis in a wide temperature range of 200-320 K.

Original languageEnglish
Article number061102
JournalApplied Physics Express
Volume11
Issue number6
DOIs
Publication statusPublished - 2018 Jun

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Fingerprint

Dive into the research topics of 'Optimized negative thermal expansion induced by gradual intermetallic charge transfer in Bi1-xSbxNiO3'. Together they form a unique fingerprint.

Cite this