TY - GEN
T1 - PDA-HyPAR
T2 - 19th International Symposium on Quality Electronic Design, ISQED 2018
AU - Dai, Jindun
AU - Li, Renjie
AU - Jiang, Xin
AU - Watanabe, Takahiro
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/5/9
Y1 - 2018/5/9
N2 - 3D Network-on-Chips (NoCs) is an efficient solution to multi-core communications. The routing algorithm has become a critical challenge for higher performance of NoCs. Performance of traditional methods based on the turn models degrades when the network gets saturated. To improve network stability after saturation, in this paper, a novel deadlock-free Path-Diversity-Aware Hybrid Planar Adaptive Routing (PDA-HyPAR) algorithm without using virtual channels is proposed. In this method, different routing rules are exploited in different XY-planes. And planar adaptive routing strategy is proposed to balance the network loads. We analyze path diversity theoretically and utilize path-diversity-aware selection strategy properly. Experimental results show that PDA-HyPAR is effective even if network load becomes heavy.
AB - 3D Network-on-Chips (NoCs) is an efficient solution to multi-core communications. The routing algorithm has become a critical challenge for higher performance of NoCs. Performance of traditional methods based on the turn models degrades when the network gets saturated. To improve network stability after saturation, in this paper, a novel deadlock-free Path-Diversity-Aware Hybrid Planar Adaptive Routing (PDA-HyPAR) algorithm without using virtual channels is proposed. In this method, different routing rules are exploited in different XY-planes. And planar adaptive routing strategy is proposed to balance the network loads. We analyze path diversity theoretically and utilize path-diversity-aware selection strategy properly. Experimental results show that PDA-HyPAR is effective even if network load becomes heavy.
KW - 3D NoCs
KW - Path-Diversity-Aware
KW - deadlock
KW - multiprocessing systems
KW - routing algorithm
UR - http://www.scopus.com/inward/record.url?scp=85047922853&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85047922853&partnerID=8YFLogxK
U2 - 10.1109/ISQED.2018.8357277
DO - 10.1109/ISQED.2018.8357277
M3 - Conference contribution
AN - SCOPUS:85047922853
T3 - Proceedings - International Symposium on Quality Electronic Design, ISQED
SP - 131
EP - 137
BT - 2018 19th International Symposium on Quality Electronic Design, ISQED 2018
PB - IEEE Computer Society
Y2 - 13 March 2018 through 14 March 2018
ER -