Polymeric reinforcement approaches and materials selection to improve board-level drop reliability of SnAgCu soldered area array packages

Hongbin Shi, Cuihua Tian, Michael Pecht, Toshitsugu Ueda

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    1 Citation (Scopus)

    Fingerprint

    Dive into the research topics of 'Polymeric reinforcement approaches and materials selection to improve board-level drop reliability of SnAgCu soldered area array packages'. Together they form a unique fingerprint.

    Engineering & Materials Science

    Chemical Compounds