Practical integration method of active devices on SOI photonic integrated circuits

Tomohiro Kita; Masahiro Abe; Yasuo Ohtera; Hirohito Yamada

doi:10.1109/GROUP4.2010.5643354

Practical integration method of active devices on SOI photonic integrated circuits

Tomohiro Kita^*, Masahiro Abe, Yasuo Ohtera, Hirohito Yamada

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

We propose a method of mounting LD chips on SOI substrate and discuss about the optical coupling loss between LDs and Si photonic-wire waveguides. In our scheme, light output from an LD is coupled to the optical waveguides through spot-size-converters (SSC). The simulations show that a minimum optical coupling loss of 1.6 dB and an offset tolerance of ±0.7 μm for the LD chip positioning can be achieved. We measured the optical coupling loss, confirming the validity of the simulations.

Original language	English
Title of host publication	2010 7th IEEE International Conference on Group IV Photonics, GFP 2010
Pages	275-277
Number of pages	3
DOIs	https://doi.org/10.1109/GROUP4.2010.5643354
Publication status	Published - 2010 Dec 1
Externally published	Yes
Event	2010 7th IEEE International Conference on Group IV Photonics, GFP 2010 - Beijing, China Duration: 2010 Sept 1 → 2010 Sept 3

Publication series

Name	IEEE International Conference on Group IV Photonics GFP
ISSN (Print)	1949-2081

Other

Other	2010 7th IEEE International Conference on Group IV Photonics, GFP 2010
Country/Territory	China
City	Beijing
Period	10/9/1 → 10/9/3

ASJC Scopus subject areas

Electrical and Electronic Engineering
Ceramics and Composites
Electronic, Optical and Magnetic Materials

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10.1109/GROUP4.2010.5643354

Cite this

Practical integration method of active devices on SOI photonic integrated circuits. / Kita, Tomohiro; Abe, Masahiro; Ohtera, Yasuo et al.
2010 7th IEEE International Conference on Group IV Photonics, GFP 2010. 2010. p. 275-277 5643354 (IEEE International Conference on Group IV Photonics GFP).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kita, T, Abe, M, Ohtera, Y & Yamada, H 2010, Practical integration method of active devices on SOI photonic integrated circuits. in 2010 7th IEEE International Conference on Group IV Photonics, GFP 2010., 5643354, IEEE International Conference on Group IV Photonics GFP, pp. 275-277, 2010 7th IEEE International Conference on Group IV Photonics, GFP 2010, Beijing, China, 10/9/1. https://doi.org/10.1109/GROUP4.2010.5643354

@inproceedings{fe9c5c211aae40c6bf97f405ab62d1bc,

title = "Practical integration method of active devices on SOI photonic integrated circuits",

abstract = "We propose a method of mounting LD chips on SOI substrate and discuss about the optical coupling loss between LDs and Si photonic-wire waveguides. In our scheme, light output from an LD is coupled to the optical waveguides through spot-size-converters (SSC). The simulations show that a minimum optical coupling loss of 1.6 dB and an offset tolerance of ±0.7 μm for the LD chip positioning can be achieved. We measured the optical coupling loss, confirming the validity of the simulations.",

author = "Tomohiro Kita and Masahiro Abe and Yasuo Ohtera and Hirohito Yamada",

year = "2010",

month = dec,

day = "1",

doi = "10.1109/GROUP4.2010.5643354",

language = "English",

isbn = "9781424463442",

series = "IEEE International Conference on Group IV Photonics GFP",

pages = "275--277",

booktitle = "2010 7th IEEE International Conference on Group IV Photonics, GFP 2010",

note = "2010 7th IEEE International Conference on Group IV Photonics, GFP 2010 ; Conference date: 01-09-2010 Through 03-09-2010",

}

TY - GEN

T1 - Practical integration method of active devices on SOI photonic integrated circuits

AU - Kita, Tomohiro

AU - Abe, Masahiro

AU - Ohtera, Yasuo

AU - Yamada, Hirohito

PY - 2010/12/1

Y1 - 2010/12/1

N2 - We propose a method of mounting LD chips on SOI substrate and discuss about the optical coupling loss between LDs and Si photonic-wire waveguides. In our scheme, light output from an LD is coupled to the optical waveguides through spot-size-converters (SSC). The simulations show that a minimum optical coupling loss of 1.6 dB and an offset tolerance of ±0.7 μm for the LD chip positioning can be achieved. We measured the optical coupling loss, confirming the validity of the simulations.

AB - We propose a method of mounting LD chips on SOI substrate and discuss about the optical coupling loss between LDs and Si photonic-wire waveguides. In our scheme, light output from an LD is coupled to the optical waveguides through spot-size-converters (SSC). The simulations show that a minimum optical coupling loss of 1.6 dB and an offset tolerance of ±0.7 μm for the LD chip positioning can be achieved. We measured the optical coupling loss, confirming the validity of the simulations.

UR - http://www.scopus.com/inward/record.url?scp=78651371680&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78651371680&partnerID=8YFLogxK

U2 - 10.1109/GROUP4.2010.5643354

DO - 10.1109/GROUP4.2010.5643354

M3 - Conference contribution

AN - SCOPUS:78651371680

SN - 9781424463442

T3 - IEEE International Conference on Group IV Photonics GFP

SP - 275

EP - 277

BT - 2010 7th IEEE International Conference on Group IV Photonics, GFP 2010

T2 - 2010 7th IEEE International Conference on Group IV Photonics, GFP 2010

Y2 - 1 September 2010 through 3 September 2010

ER -

Practical integration method of active devices on SOI photonic integrated circuits

Abstract

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ASJC Scopus subject areas

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