Preparation of Ni-Sn Alloys by an Electroless-Deposition Method

Hidenori Shimauchi, Keiu Tamura, Tetsuya Osaka

Research output: Contribution to journalArticlepeer-review

21 Citations (Scopus)


Electroless-deposited Ni-Sn alloy films were investigated to increase tin content in the deposit. The maximum tin contents of electroless Ni-Sn-P and Ni-Sn-B were ca. 30 atom percent (a/o) and 42 a/o, respectively. The maximum tin content in the case of Ni-Sn-B was nearly equal to that of electrodeposited Ni-Sn alloy already reported. The crystallinity of Ni-Sn-P and Ni-Sn-B alloys was raised up with an increase in tin content. The corrosion resistance of Ni-Sn-P and Ni-Sn-B alloys was between that of amorphous and crystalline electroless-deposited Ni-P. Codeposition of tin into Ni-P films improved solderability but into the Ni-B films, the solderability of Ni-Sn-B films situated in the region between those of Ni-P and NiB, because the solderability of NiB is higher.

Original languageEnglish
Pages (from-to)1471-1476
Number of pages6
JournalJournal of the Electrochemical Society
Issue number6
Publication statusPublished - 1994 Jun
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Renewable Energy, Sustainability and the Environment


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