Preparation of photo-curing acrylate thin films containing Pd nanoparticles and their application for electroless plating catalysts

Takashi Hamada; Seiji Watase; Yukihito Matsuura; Hiroshi Kondo; Noboru Nishioka; Kimihiro Matsukawa

doi:10.2494/photopolymer.20.137

Preparation of photo-curing acrylate thin films containing Pd nanoparticles and their application for electroless plating catalysts

Takashi Hamada^*, Seiji Watase, Yukihito Matsuura, Hiroshi Kondo, Noboru Nishioka, Kimihiro Matsukawa

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

A novel strategy to fabricate the copper pattern by electroless copper plating was investigated. The photolithographic negative patterns were fabricated by using the hybrid films with the palladium nanoparticles. The palladium nanoparticles in photo-cured acrylate thin films were an effective catalyst for the electroless copper plating, and it was easily to form the catalysis fine patterns by UV irradiation and development. Addition of silica nanoparticles to the hybrid thin films enhanced the performance of catalyst for the electroless copper plating and adhesion between the thin film and deposited copper.

Original language	English
Pages (from-to)	137-140
Number of pages	4
Journal	Journal of Photopolymer Science and Technology
Volume	20
Issue number	1
DOIs	https://doi.org/10.2494/photopolymer.20.137
Publication status	Published - 2007
Externally published	Yes

Keywords

Electroless copper plating
Multi-functional acrylate
Organic-inorganic hybrid films
Palladium nanoparticles
Silica nanoparticles

ASJC Scopus subject areas

Polymers and Plastics
Organic Chemistry
Materials Chemistry

Access to Document

10.2494/photopolymer.20.137

Cite this

@article{b4027a5785d04fd8826a2a99fe9439c4,

title = "Preparation of photo-curing acrylate thin films containing Pd nanoparticles and their application for electroless plating catalysts",

abstract = "A novel strategy to fabricate the copper pattern by electroless copper plating was investigated. The photolithographic negative patterns were fabricated by using the hybrid films with the palladium nanoparticles. The palladium nanoparticles in photo-cured acrylate thin films were an effective catalyst for the electroless copper plating, and it was easily to form the catalysis fine patterns by UV irradiation and development. Addition of silica nanoparticles to the hybrid thin films enhanced the performance of catalyst for the electroless copper plating and adhesion between the thin film and deposited copper.",

keywords = "Electroless copper plating, Multi-functional acrylate, Organic-inorganic hybrid films, Palladium nanoparticles, Silica nanoparticles",

author = "Takashi Hamada and Seiji Watase and Yukihito Matsuura and Hiroshi Kondo and Noboru Nishioka and Kimihiro Matsukawa",

year = "2007",

doi = "10.2494/photopolymer.20.137",

language = "English",

volume = "20",

pages = "137--140",

journal = "Journal of Photopolymer Science and Technology",

issn = "0914-9244",

publisher = "Tokai University",

number = "1",

}

TY - JOUR

T1 - Preparation of photo-curing acrylate thin films containing Pd nanoparticles and their application for electroless plating catalysts

AU - Hamada, Takashi

AU - Watase, Seiji

AU - Matsuura, Yukihito

AU - Kondo, Hiroshi

AU - Nishioka, Noboru

AU - Matsukawa, Kimihiro

PY - 2007

Y1 - 2007

N2 - A novel strategy to fabricate the copper pattern by electroless copper plating was investigated. The photolithographic negative patterns were fabricated by using the hybrid films with the palladium nanoparticles. The palladium nanoparticles in photo-cured acrylate thin films were an effective catalyst for the electroless copper plating, and it was easily to form the catalysis fine patterns by UV irradiation and development. Addition of silica nanoparticles to the hybrid thin films enhanced the performance of catalyst for the electroless copper plating and adhesion between the thin film and deposited copper.

AB - A novel strategy to fabricate the copper pattern by electroless copper plating was investigated. The photolithographic negative patterns were fabricated by using the hybrid films with the palladium nanoparticles. The palladium nanoparticles in photo-cured acrylate thin films were an effective catalyst for the electroless copper plating, and it was easily to form the catalysis fine patterns by UV irradiation and development. Addition of silica nanoparticles to the hybrid thin films enhanced the performance of catalyst for the electroless copper plating and adhesion between the thin film and deposited copper.

KW - Electroless copper plating

KW - Multi-functional acrylate

KW - Organic-inorganic hybrid films

KW - Palladium nanoparticles

KW - Silica nanoparticles

UR - http://www.scopus.com/inward/record.url?scp=34548458925&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34548458925&partnerID=8YFLogxK

U2 - 10.2494/photopolymer.20.137

DO - 10.2494/photopolymer.20.137

M3 - Article

AN - SCOPUS:34548458925

SN - 0914-9244

VL - 20

SP - 137

EP - 140

JO - Journal of Photopolymer Science and Technology

JF - Journal of Photopolymer Science and Technology

IS - 1

ER -

Preparation of photo-curing acrylate thin films containing Pd nanoparticles and their application for electroless plating catalysts

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this