Pyrolyzed polymer MESH electrode integrated into fluidic channel for gate type sensor

Kensaku Yamamoto*, Keisuke Naka, Yasuhiro Nagaura, Hironobu Sato, Shuichi Shoji, Satoshi Konishi

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

This paper presents a novel means of introducing conductive pyrolyzed polymer structures into a μTAS platform. Insulation structures of polymer materials can be transformed into conductive structures through pyrolysis, and MEMS structures consisting of pyrolyzed polymer can be formed by a dual process of micromachining and pyrolysis. This work focuses on gate type sensing by a three-dimensional pyrolyzed polymer electrode. The three-dimensional SU-8 original structure was micromachined by multi-angle inclined lithography. Three-dimensional structures of pyrolyzed SU-8, which have meshes of 10 μm × 20 μm in dimension, could be obtained by pyrolysis in N2 atmosphere. Furthermore, the structures were integrated into the SU-8 fluidic channel with the 100 μm in height and 200 μm in width by a post-pyrolysis process. We will demonstrate the cross sectional sensing in electrochemical detection by making the best use of the three-dimensional mesh structure to overcome the restriction of planar electrode.

Original languageEnglish
Title of host publicationProceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
Pages271-274
Number of pages4
Publication statusPublished - 2007
Event20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 - Kobe, Japan
Duration: 2007 Jan 212007 Jan 25

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
Country/TerritoryJapan
CityKobe
Period07/1/2107/1/25

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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