The aim of this study is to measure the cure shrinkage of epoxy resin system used in the CFRP. First, the cure kinetics of Bisphenol A type epoxy resin system was studied by Differential Scanning Calorimetry measurement. From the dynamic DSC measurement, the total heat of cure of the epoxy was determined as 293 [kJ/g]. Also, curing condition and the extent of cure were determined by the isothermal DSC and TGA measurement. By controlling the curing condition, immature cured epoxy bar-shaped specimen was moulded. The cure shrinkage was measured by using the laser confocal displacement meter without any contact with the bar-shaped specimen. Comparing the specimen size after each cure, cure shrinkage of the bar-shaped specimen was measured.
|Title of host publication
|ICCM International Conferences on Composite Materials
|Published - 2007
|16th International Conference on Composite Materials, ICCM-16 - "A Giant Step Towards Environmental Awareness: From Green Composites to Aerospace" - Kyoto
Duration: 2007 Jul 8 → 2007 Jul 13
|16th International Conference on Composite Materials, ICCM-16 - "A Giant Step Towards Environmental Awareness: From Green Composites to Aerospace"
|07/7/8 → 07/7/13
- Cure shrinkage
ASJC Scopus subject areas
- General Engineering
- Ceramics and Composites