Relation between the Glass Transition and Dielectric Properties in Bisphenol A and F Epoxy Resins

Keigo Mori; Naoshi Hirai; Yoshimichi Ohki; Yasutomo Otake; Takahiro Umemoto; Hirotaka Muto

doi:10.1109/CEIDP47102.2019.9010555

Relation between the Glass Transition and Dielectric Properties in Bisphenol A and F Epoxy Resins

Keigo Mori, Naoshi Hirai, Yoshimichi Ohki, Yasutomo Otake, Takahiro Umemoto, Hirotaka Muto

Kagami Memorial Research Institute for Materials Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

Bisphenol A and F epoxy resins, EA and EF for short respectively, are used widely for insulation in power apparatus. In this paper, we compare the superiority in dielectric property between EA and EF. For EA and EF cured at two different conditions, the glass transition temperature (T_g), complex relative permittivity (ϵ_r' - jϵ_r), conductivity (σ), thermally stimulated depolarization current (TSDC), and bending elastic modulus were measured. As a result, EF has a lower T_g than EA. Regarding this, in EF, ϵ_r', ϵ_r, and σ rapidly increase when the temperature exceeds 140 °C and the difference in dielectric property between EA and EF becomes significant in this temperature range.

Original language	English
Title of host publication	2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	426-429
Number of pages	4
ISBN (Electronic)	9781728131214
DOIs	https://doi.org/10.1109/CEIDP47102.2019.9010555
Publication status	Published - 2019 Oct
Event	2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Richland, United States Duration: 2019 Oct 20 → 2019 Oct 23

Publication series

Name	Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
Volume	2019-October
ISSN (Print)	0084-9162

Conference

Conference	2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019
Country/Territory	United States
City	Richland
Period	19/10/20 → 19/10/23

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/CEIDP47102.2019.9010555

Cite this

Mori, K., Hirai, N., Ohki, Y., Otake, Y., Umemoto, T., & Muto, H. (2019). Relation between the Glass Transition and Dielectric Properties in Bisphenol A and F Epoxy Resins. In 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings (pp. 426-429). [9010555] (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP; Vol. 2019-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CEIDP47102.2019.9010555

Relation between the Glass Transition and Dielectric Properties in Bisphenol A and F Epoxy Resins. / Mori, Keigo; Hirai, Naoshi; Ohki, Yoshimichi et al.
2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. p. 426-429 9010555 (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP; Vol. 2019-October).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Mori, K, Hirai, N, Ohki, Y, Otake, Y, Umemoto, T & Muto, H 2019, Relation between the Glass Transition and Dielectric Properties in Bisphenol A and F Epoxy Resins. in 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings., 9010555, Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, vol. 2019-October, Institute of Electrical and Electronics Engineers Inc., pp. 426-429, 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019, Richland, United States, 19/10/20. https://doi.org/10.1109/CEIDP47102.2019.9010555

Mori K, Hirai N, Ohki Y, Otake Y, Umemoto T, Muto H. Relation between the Glass Transition and Dielectric Properties in Bisphenol A and F Epoxy Resins. In 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2019. p. 426-429. 9010555. (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP). doi: 10.1109/CEIDP47102.2019.9010555

Mori, Keigo ; Hirai, Naoshi ; Ohki, Yoshimichi et al. / Relation between the Glass Transition and Dielectric Properties in Bisphenol A and F Epoxy Resins. 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 426-429 (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP).

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abstract = "Bisphenol A and F epoxy resins, EA and EF for short respectively, are used widely for insulation in power apparatus. In this paper, we compare the superiority in dielectric property between EA and EF. For EA and EF cured at two different conditions, the glass transition temperature (Tg), complex relative permittivity (ϵr' - jϵr), conductivity (σ), thermally stimulated depolarization current (TSDC), and bending elastic modulus were measured. As a result, EF has a lower Tg than EA. Regarding this, in EF, ϵr', ϵr, and σ rapidly increase when the temperature exceeds 140 °C and the difference in dielectric property between EA and EF becomes significant in this temperature range.",

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Relation between the Glass Transition and Dielectric Properties in Bisphenol A and F Epoxy Resins

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