TY - GEN
T1 - Relationships of design parameters and the cooling performance of the spiral-fin heatsink
AU - Otake, Shingo
AU - Hori, Motohito
AU - Kato, Ryoichi
AU - Ikeda, Yoshinari
AU - Parque, Victor
AU - Faiz, Muhammad Khairi
AU - Yoshida, Makoto
AU - Miyashita, Tomoyuki
N1 - Funding Information:
ACKNOWLEDGMENT This work was supported by Council for Science, Technology and Innovation (CSTI), Cross-ministerial Strategic Innovation Promotion Program (SIP), “Energy systems of an Internet of Energy (IoE) society” (Funding agency: JST).
Publisher Copyright:
© 2021 IEEE.
PY - 2021/5/12
Y1 - 2021/5/12
N2 - Due to the demand for miniaturization, further improvement in cooling performance is required for power modules. The spiral-fin heatsink we considered has higher cooling performance than conventional ones. In this paper, we examined the design parameters of the spiral-fin, and found that three parameters of spiral-fin have big effect for the cooling performance .
AB - Due to the demand for miniaturization, further improvement in cooling performance is required for power modules. The spiral-fin heatsink we considered has higher cooling performance than conventional ones. In this paper, we examined the design parameters of the spiral-fin, and found that three parameters of spiral-fin have big effect for the cooling performance .
KW - 3Dprinter
KW - Heatsink
UR - http://www.scopus.com/inward/record.url?scp=85113315347&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85113315347&partnerID=8YFLogxK
U2 - 10.23919/ICEP51988.2021.9451967
DO - 10.23919/ICEP51988.2021.9451967
M3 - Conference contribution
AN - SCOPUS:85113315347
T3 - 2021 International Conference on Electronics Packaging, ICEP 2021
SP - 161
EP - 162
BT - 2021 International Conference on Electronics Packaging, ICEP 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Electronics Packaging, ICEP 2021
Y2 - 12 May 2021 through 14 May 2021
ER -