Reliability, Applications and Challenges of GaN HEMT Technology for Modern Power Devices: A Review

Naeemul Islam, Mohamed Fauzi Packeer Mohamed*, Muhammad Firdaus Akbar Jalaludin Khan, Shaili Falina*, Hiroshi Kawarada, Mohd Syamsul*

*Corresponding author for this work

Research output: Contribution to journalReview articlepeer-review

63 Citations (Scopus)

Abstract

A new generation of high-efficiency power devices is being developed using wide bandgap (WBG) semiconductors, like GaN and SiC, which are emerging as attractive alternatives to silicon. The recent interest in GaN has been piqued by its excellent material characteristics, including its high critical electric field, high saturation velocity, high electron mobility, and outstanding thermal stability. Therefore, the superior performance is represented by GaN-based high electron mobility transistor (HEMT) devices. They can perform at higher currents, voltages, temperatures, and frequencies, making them suitable devices for the next generation of high-efficiency power converter applications, including electric vehicles, phone chargers, renewable energy, and data centers. Thus, this review article will provide a basic overview of the various technological and scientific elements of the current GaN HEMTs technology. First, the present advancements in the GaN market and its primary application areas are briefly summarized. After that, the GaN is compared with other devices, and the GaN HEMT device’s operational material properties with different heterostructures are discussed. Then, the normally-off GaN HEMT technology with their different types are considered, especially on the recessed gate metal insulator semiconductor high electron mobility transistor (MISHEMT) and p-GaN. Hereafter, this review also discusses the reliability concerns of the GaN HEMT which are caused by trap effects like a drain, gate lag, and current collapse with numerous types of degradation. Eventually, the breakdown voltage of the GaN HEMT with some challenges has been studied.

Original languageEnglish
Article number1581
JournalCrystals
Volume12
Issue number11
DOIs
Publication statusPublished - 2022 Nov

Keywords

  • GaN HEMT
  • challenges
  • normally off
  • power devices
  • reliability
  • semiconductor devices
  • wide bandgap

ASJC Scopus subject areas

  • General Chemical Engineering
  • General Materials Science
  • Condensed Matter Physics
  • Inorganic Chemistry

Fingerprint

Dive into the research topics of 'Reliability, Applications and Challenges of GaN HEMT Technology for Modern Power Devices: A Review'. Together they form a unique fingerprint.

Cite this