Room-temperature bonding technique based on copper nanowire surface fastener

Peng Wang, Yang Ju*, Mingji Chen, Atsushi Hosoi, Yuanhui Song, Yuka Iwasaki

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)

Abstract

A free-standing copper nanowire array was directly fabricated on a silicon substrate by improved template-assisted electrodeposition. A roomtemperature bonding technique was realized by pressing two nanowire arrays against each other. The van der Waals forces between the interconnected nanowires contributed to the room-temperature bonding which exhibited good mechanical and electrical properties. Theoretical analysis further showed that a much higher mechanical strength can be obtained if most copper nanowires could interconnect with each other.

Original languageEnglish
Article number035001
JournalApplied Physics Express
Volume6
Issue number3
DOIs
Publication statusPublished - 2013 Mar
Externally publishedYes

ASJC Scopus subject areas

  • General Engineering
  • General Physics and Astronomy

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