Room temperature electrical bonding technique based on titled copper nanowire fastener with anisotropic adhesion properties

Peng Wang; Yang Ju; Atsuchi Hosoi; Yuanhui Song

doi:10.1109/NANO.2012.6322167

Room temperature electrical bonding technique based on titled copper nanowire fastener with anisotropic adhesion properties

Peng Wang^*, Yang Ju, Atsuchi Hosoi, Yuanhui Song

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

This paper presented a room temperature bonding technique based on copper nanowire. A structure with copper nanowire array growing on the patterned areas of the silicon substrate was prepared through template-assistant electro-deposition. Through pressing the tilted and straight nanowire arrays against each other, the van der Waals interactions between the interconnected nanowires resulted in the mechanical bonding and electrical connectivity. This room temperature bonding technique exhibited anisotropic adhesion properties. The maximum adhesive strength of 9.36 N/cm² and electrical resistance of 0.3 (areas, A3.14 mm²) were obtained. Hence, it might have important implications for the assembly of components in the micro electronics.

Original language	English
Title of host publication	2012 12th IEEE International Conference on Nanotechnology, NANO 2012
DOIs	https://doi.org/10.1109/NANO.2012.6322167
Publication status	Published - 2012
Externally published	Yes
Event	2012 12th IEEE International Conference on Nanotechnology, NANO 2012 - Birmingham, United Kingdom Duration: 2012 Aug 20 → 2012 Aug 23

Publication series

Name	Proceedings of the IEEE Conference on Nanotechnology
ISSN (Print)	1944-9399
ISSN (Electronic)	1944-9380

Conference

Conference	2012 12th IEEE International Conference on Nanotechnology, NANO 2012
Country/Territory	United Kingdom
City	Birmingham
Period	12/8/20 → 12/8/23

ASJC Scopus subject areas

Bioengineering
Electrical and Electronic Engineering
Materials Chemistry
Condensed Matter Physics

Access to Document

10.1109/NANO.2012.6322167

Cite this

Room temperature electrical bonding technique based on titled copper nanowire fastener with anisotropic adhesion properties. / Wang, Peng; Ju, Yang; Hosoi, Atsuchi et al.
2012 12th IEEE International Conference on Nanotechnology, NANO 2012. 2012. 6322167 (Proceedings of the IEEE Conference on Nanotechnology).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Wang, P, Ju, Y, Hosoi, A & Song, Y 2012, Room temperature electrical bonding technique based on titled copper nanowire fastener with anisotropic adhesion properties. in 2012 12th IEEE International Conference on Nanotechnology, NANO 2012., 6322167, Proceedings of the IEEE Conference on Nanotechnology, 2012 12th IEEE International Conference on Nanotechnology, NANO 2012, Birmingham, United Kingdom, 12/8/20. https://doi.org/10.1109/NANO.2012.6322167

@inproceedings{1d516dc3af714b9e8e174ef5b2dae15c,

title = "Room temperature electrical bonding technique based on titled copper nanowire fastener with anisotropic adhesion properties",

abstract = "This paper presented a room temperature bonding technique based on copper nanowire. A structure with copper nanowire array growing on the patterned areas of the silicon substrate was prepared through template-assistant electro-deposition. Through pressing the tilted and straight nanowire arrays against each other, the van der Waals interactions between the interconnected nanowires resulted in the mechanical bonding and electrical connectivity. This room temperature bonding technique exhibited anisotropic adhesion properties. The maximum adhesive strength of 9.36 N/cm2 and electrical resistance of 0.3 (areas, A3.14 mm2) were obtained. Hence, it might have important implications for the assembly of components in the micro electronics.",

author = "Peng Wang and Yang Ju and Atsuchi Hosoi and Yuanhui Song",

year = "2012",

doi = "10.1109/NANO.2012.6322167",

language = "English",

isbn = "9781467321983",

series = "Proceedings of the IEEE Conference on Nanotechnology",

booktitle = "2012 12th IEEE International Conference on Nanotechnology, NANO 2012",

note = "2012 12th IEEE International Conference on Nanotechnology, NANO 2012 ; Conference date: 20-08-2012 Through 23-08-2012",

}

TY - GEN

T1 - Room temperature electrical bonding technique based on titled copper nanowire fastener with anisotropic adhesion properties

AU - Wang, Peng

AU - Ju, Yang

AU - Hosoi, Atsuchi

AU - Song, Yuanhui

PY - 2012

Y1 - 2012

N2 - This paper presented a room temperature bonding technique based on copper nanowire. A structure with copper nanowire array growing on the patterned areas of the silicon substrate was prepared through template-assistant electro-deposition. Through pressing the tilted and straight nanowire arrays against each other, the van der Waals interactions between the interconnected nanowires resulted in the mechanical bonding and electrical connectivity. This room temperature bonding technique exhibited anisotropic adhesion properties. The maximum adhesive strength of 9.36 N/cm2 and electrical resistance of 0.3 (areas, A3.14 mm2) were obtained. Hence, it might have important implications for the assembly of components in the micro electronics.

AB - This paper presented a room temperature bonding technique based on copper nanowire. A structure with copper nanowire array growing on the patterned areas of the silicon substrate was prepared through template-assistant electro-deposition. Through pressing the tilted and straight nanowire arrays against each other, the van der Waals interactions between the interconnected nanowires resulted in the mechanical bonding and electrical connectivity. This room temperature bonding technique exhibited anisotropic adhesion properties. The maximum adhesive strength of 9.36 N/cm2 and electrical resistance of 0.3 (areas, A3.14 mm2) were obtained. Hence, it might have important implications for the assembly of components in the micro electronics.

UR - http://www.scopus.com/inward/record.url?scp=84869187277&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84869187277&partnerID=8YFLogxK

U2 - 10.1109/NANO.2012.6322167

DO - 10.1109/NANO.2012.6322167

M3 - Conference contribution

AN - SCOPUS:84869187277

SN - 9781467321983

T3 - Proceedings of the IEEE Conference on Nanotechnology

BT - 2012 12th IEEE International Conference on Nanotechnology, NANO 2012

T2 - 2012 12th IEEE International Conference on Nanotechnology, NANO 2012

Y2 - 20 August 2012 through 23 August 2012

ER -

Room temperature electrical bonding technique based on titled copper nanowire fastener with anisotropic adhesion properties

Abstract

Publication series

Conference

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this