Sequential Batch Assembly of 3-D Microstructures by using a Magnetic Anisotropy and a Magnetic Field

Eiji Iwase, Isao Shimoyama

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)


This paper describes three-dimensional (3-D) microstructure assembly using an external magnetic field. An external magnetic field perpendicular to a substrate lifts a hinged structure by the torque due to the shape magnetic anisotropy. We made micro flap structures (4.5 μm-thick electroplated Permalloy) which have 0.2 μ,m-thick nickel elastic hinges in various size, and made lift the structures in a magnetic field up to 50 kA/m. We demonstrated that the non-dimensional factor depending on the volume of magnetic material and the stiffness of the hinges determine the sensitivity to the magnetic field. As a result, we realized sequential batch assembly using the difference of the sensitivity. The each two plates 600 μm x 600 μm in size were lifted sequentially, and out-of-plane microstructures were assembled. And the complex out-of-plan microstructures, the regular tetrahedrons 800 μm on a side with a closed linkage were able to assemble by our method.

Original languageEnglish
Pages (from-to)224-230
Number of pages7
Journalieej transactions on sensors and micromachines
Issue number7
Publication statusPublished - 2003
Externally publishedYes


  • MEMS(Micro-Electro-Mechanical Systems)
  • elastic hinges
  • magnetic anisotropy
  • out-of-plane structures
  • sequential assembly

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering


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