Abstract
This paper describes three-dimensional (3-D) microstructure assembly using an external magnetic field. An external magnetic field perpendicular to a substrate lifts a hinged structure by the torque due to the shape magnetic anisotropy. We made micro flap structures (4.5 μm-thick electroplated Permalloy) which have 0.2 μ,m-thick nickel elastic hinges in various size, and made lift the structures in a magnetic field up to 50 kA/m. We demonstrated that the non-dimensional factor depending on the volume of magnetic material and the stiffness of the hinges determine the sensitivity to the magnetic field. As a result, we realized sequential batch assembly using the difference of the sensitivity. The each two plates 600 μm x 600 μm in size were lifted sequentially, and out-of-plane microstructures were assembled. And the complex out-of-plan microstructures, the regular tetrahedrons 800 μm on a side with a closed linkage were able to assemble by our method.
Original language | English |
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Pages (from-to) | 224-230 |
Number of pages | 7 |
Journal | ieej transactions on sensors and micromachines |
Volume | 123 |
Issue number | 7 |
DOIs | |
Publication status | Published - 2003 |
Externally published | Yes |
Keywords
- MEMS(Micro-Electro-Mechanical Systems)
- elastic hinges
- magnetic anisotropy
- out-of-plane structures
- sequential assembly
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering