Fingerprint
Dive into the research topics of 'SiC wafer bonding by modified suface activated bonding method'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
SiC wafer bonding by modified suface activated bonding method
Fengwen Mu, Tadatomo Suga, Masahisa Fujino, Yoshikazu Takahashi, Haruo Nakazawa, Kenichi Iguchi
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2
Citations
(Scopus)