SiC wafer bonding using surface activation method for power device

Fengwen Mu, Masahisa Fujino, Tadatomo Suga, Kenichi Iguchi, Haruo Nakazawa, Yoshikazu Takahashi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Fingerprint

Dive into the research topics of 'SiC wafer bonding using surface activation method for power device'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds