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Simple through silicon interconnect via fabrication using dry filling of sub-micron Au particles for 3D MEMS
K. Shih*, M. Nimura, Y. Kanehira, T. Ogashiwa, J. Mizuno, S. Shoji
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3
Citations
(Scopus)