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Simultaneous fabrication of a through-glass interconnect via and a bump using dry film resist and submicron gold particles
Hayata Mimatsu, Jun Mizuno, Shuichi Shoji, Takashi Kasahara, Kailing Shih, Kazuya Nomura, Yukio Kanehira, Toshinori Ogashiwa
Research output: Contribution to journal › Article › peer-review
3
Citations
(Scopus)