Study of LiTaO3/ST-quartz Bonding with Amorphous Interlayer Assisted by VUV/O3 Treatment for SAW Device

Haruka Suzaki; Hiroyuki Kuwae; Akiko Okada; Shuichi Shoji; Jun Mizuno

doi:10.1109/IMPACT.2016.7799986

Study of LiTaO3/ST-quartz Bonding with Amorphous Interlayer Assisted by VUV/O3 Treatment for SAW Device

Haruka Suzaki, Hiroyuki Kuwae, Akiko Okada, Shuichi Shoji, Jun Mizuno

Research Organization for Nano & Life Innovation

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Development of surface acoustic wave (SAW) devices has been getting attention to achieve next fifth generation (5G) mobile communications. We had previously proposed a temperature compensated SAW substrate, LiTaO₃ (LT: lithium tantalate)/ST-cut quartz (ST-quartz), with which directly combined piezoelectric single crystals using amorphous intermediate bonding (AIB) method. In this paper, we investigate bonding characteristics using different amorphous layers with the object of improving bonding of piezoelectric single crystals for future SAW devices. We applied amorphous Al₂O₃ (α-Al₂O₃) as intermediate layers as well as previously reported amorphous SiO₂ (α-SiO₂) to the bonding interface of LT and ST-quartz, since a-Al₂O₃ has high water corrosion resistance against to the hydrophilic treatment. The substrates with both of the amorphous intermediate layers were successfully bonded assisted with vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O₃). Especially, the substrate with the a-Al₂O₃ layer achieved the dominant highest bonding strength of 10.5 MPa, which is approximately three times stronger than the substrate with the α-SiO₂ layer. These results indicate that the α-Al₂O₃ layer is preferable to improve effects of VUV/O₃ hydrophilic treatment and fabricate LT/ST-quartz substrate. To investigate the amorphous interlayers can be promising for making piezoelectric single crystals bonding enough strong to fabricate the future SAW devices.

Original language	English
Title of host publication	11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings
Publisher	IEEE Computer Society
Pages	239-242
Number of pages	4
ISBN (Electronic)	9781509047697
DOIs	https://doi.org/10.1109/IMPACT.2016.7799986
Publication status	Published - 2016 Dec 27
Event	11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Taipei, Taiwan, Province of China Duration: 2016 Oct 26 → 2016 Oct 28

Other

Other	11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016
Country/Territory	Taiwan, Province of China
City	Taipei
Period	16/10/26 → 16/10/28

ASJC Scopus subject areas

Hardware and Architecture
Control and Systems Engineering
Electrical and Electronic Engineering

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10.1109/IMPACT.2016.7799986

Cite this

Suzaki, H., Kuwae, H., Okada, A., Shoji, S., & Mizuno, J. (2016). Study of LiTaO3/ST-quartz Bonding with Amorphous Interlayer Assisted by VUV/O3 Treatment for SAW Device. In 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings (pp. 239-242). Article 7799986 IEEE Computer Society. https://doi.org/10.1109/IMPACT.2016.7799986

Study of LiTaO3/ST-quartz Bonding with Amorphous Interlayer Assisted by VUV/O3 Treatment for SAW Device. / Suzaki, Haruka; Kuwae, Hiroyuki; Okada, Akiko et al.
11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, 2016. p. 239-242 7799986.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Suzaki, H, Kuwae, H, Okada, A, Shoji, S & Mizuno, J 2016, Study of LiTaO3/ST-quartz Bonding with Amorphous Interlayer Assisted by VUV/O3 Treatment for SAW Device. in 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings., 7799986, IEEE Computer Society, pp. 239-242, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016, Taipei, Taiwan, Province of China, 16/10/26. https://doi.org/10.1109/IMPACT.2016.7799986

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abstract = "Development of surface acoustic wave (SAW) devices has been getting attention to achieve next fifth generation (5G) mobile communications. We had previously proposed a temperature compensated SAW substrate, LiTaO3 (LT: lithium tantalate)/ST-cut quartz (ST-quartz), with which directly combined piezoelectric single crystals using amorphous intermediate bonding (AIB) method. In this paper, we investigate bonding characteristics using different amorphous layers with the object of improving bonding of piezoelectric single crystals for future SAW devices. We applied amorphous Al2O3 (α-Al2O3) as intermediate layers as well as previously reported amorphous SiO2 (α-SiO2) to the bonding interface of LT and ST-quartz, since a-Al2O3 has high water corrosion resistance against to the hydrophilic treatment. The substrates with both of the amorphous intermediate layers were successfully bonded assisted with vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O3). Especially, the substrate with the a-Al2O3 layer achieved the dominant highest bonding strength of 10.5 MPa, which is approximately three times stronger than the substrate with the α-SiO2 layer. These results indicate that the α-Al2O3 layer is preferable to improve effects of VUV/O3 hydrophilic treatment and fabricate LT/ST-quartz substrate. To investigate the amorphous interlayers can be promising for making piezoelectric single crystals bonding enough strong to fabricate the future SAW devices.",

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AB - Development of surface acoustic wave (SAW) devices has been getting attention to achieve next fifth generation (5G) mobile communications. We had previously proposed a temperature compensated SAW substrate, LiTaO3 (LT: lithium tantalate)/ST-cut quartz (ST-quartz), with which directly combined piezoelectric single crystals using amorphous intermediate bonding (AIB) method. In this paper, we investigate bonding characteristics using different amorphous layers with the object of improving bonding of piezoelectric single crystals for future SAW devices. We applied amorphous Al2O3 (α-Al2O3) as intermediate layers as well as previously reported amorphous SiO2 (α-SiO2) to the bonding interface of LT and ST-quartz, since a-Al2O3 has high water corrosion resistance against to the hydrophilic treatment. The substrates with both of the amorphous intermediate layers were successfully bonded assisted with vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O3). Especially, the substrate with the a-Al2O3 layer achieved the dominant highest bonding strength of 10.5 MPa, which is approximately three times stronger than the substrate with the α-SiO2 layer. These results indicate that the α-Al2O3 layer is preferable to improve effects of VUV/O3 hydrophilic treatment and fabricate LT/ST-quartz substrate. To investigate the amorphous interlayers can be promising for making piezoelectric single crystals bonding enough strong to fabricate the future SAW devices.

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Study of LiTaO3/ST-quartz Bonding with Amorphous Interlayer Assisted by VUV/O3 Treatment for SAW Device

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