Study of low-temperature wafer bonding with Au-Au bonding technique

H. Kurotaki; H. Shinohara; H. Kobayashi; J. Mizuno; S. Shoji

doi:10.1115/MicroNano2008-70064

Study of low-temperature wafer bonding with Au-Au bonding technique

H. Kurotaki^*, H. Shinohara, H. Kobayashi, J. Mizuno, S. Shoji

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Original language	English
Title of host publication	2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
Pages	747-748
Number of pages	2
DOIs	https://doi.org/10.1115/MicroNano2008-70064
Publication status	Published - 2008 Dec 1
Event	2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 - Kowloon, Hong Kong Duration: 2008 Jun 3 → 2008 Jun 5

Publication series

Name	2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008

Conference

Conference	2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
Country/Territory	Hong Kong
City	Kowloon
Period	08/6/3 → 08/6/5

ASJC Scopus subject areas

Biotechnology
Electrical and Electronic Engineering

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10.1115/MicroNano2008-70064

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Kurotaki, H., Shinohara, H., Kobayashi, H., Mizuno, J., & Shoji, S. (2008). Study of low-temperature wafer bonding with Au-Au bonding technique. In 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 (pp. 747-748). (2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008). https://doi.org/10.1115/MicroNano2008-70064

Study of low-temperature wafer bonding with Au-Au bonding technique. / Kurotaki, H.; Shinohara, H.; Kobayashi, H. et al.
2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008. p. 747-748 (2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kurotaki, H, Shinohara, H, Kobayashi, H, Mizuno, J & Shoji, S 2008, Study of low-temperature wafer bonding with Au-Au bonding technique. in 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008, pp. 747-748, 2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008, Kowloon, Hong Kong, 08/6/3. https://doi.org/10.1115/MicroNano2008-70064

Kurotaki H, Shinohara H, Kobayashi H, Mizuno J, Shoji S. Study of low-temperature wafer bonding with Au-Au bonding technique. In 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008. p. 747-748. (2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008). doi: 10.1115/MicroNano2008-70064

Kurotaki, H. ; Shinohara, H. ; Kobayashi, H. et al. / Study of low-temperature wafer bonding with Au-Au bonding technique. 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008. pp. 747-748 (2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008).

@inproceedings{44410e1bccfe4e3c9d50406d21001886,

title = "Study of low-temperature wafer bonding with Au-Au bonding technique",

author = "H. Kurotaki and H. Shinohara and H. Kobayashi and J. Mizuno and S. Shoji",

year = "2008",

month = dec,

day = "1",

doi = "10.1115/MicroNano2008-70064",

language = "English",

isbn = "0791842940",

series = "2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008",

pages = "747--748",

booktitle = "2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008",

note = "2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 ; Conference date: 03-06-2008 Through 05-06-2008",

}

TY - GEN

T1 - Study of low-temperature wafer bonding with Au-Au bonding technique

AU - Kurotaki, H.

AU - Shinohara, H.

AU - Kobayashi, H.

AU - Mizuno, J.

AU - Shoji, S.

PY - 2008/12/1

Y1 - 2008/12/1

UR - http://www.scopus.com/inward/record.url?scp=69949135352&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=69949135352&partnerID=8YFLogxK

U2 - 10.1115/MicroNano2008-70064

DO - 10.1115/MicroNano2008-70064

M3 - Conference contribution

AN - SCOPUS:69949135352

SN - 0791842940

SN - 9780791842942

T3 - 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008

SP - 747

EP - 748

BT - 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008

T2 - 2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008

Y2 - 3 June 2008 through 5 June 2008

ER -

Study of low-temperature wafer bonding with Au-Au bonding technique

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