TY - GEN
T1 - Termination with Stubs in Resistive Film
AU - Ishibashi, Hidenori
AU - Tarui, Yukihiro
AU - Onodera, Yuko
AU - Takahashi, Toru
AU - Yoneda, Naofumi
AU - Miyazaki, Moriyasu
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/9
Y1 - 2020/9
N2 - In recent years, T/R modules have required surface mount terminations with high-power capability for cost reduction. Terminations with large resistive film on aluminum nitride have been proposed as a method for high power use. However, they have a problem that it is difficult to obtain the broadband terminations. Therefore, we propose a novel termination with stubs in resistive film. This termination can disperse heat by resonating an input signal with open stubs. Hence, the proposed termination improved surface loss density by 50% compared to the conventional one. In addition, we show that the fabricated termination has the reflection coefficient characteristics smaller than-20B in the bandwidth of 43.3%.
AB - In recent years, T/R modules have required surface mount terminations with high-power capability for cost reduction. Terminations with large resistive film on aluminum nitride have been proposed as a method for high power use. However, they have a problem that it is difficult to obtain the broadband terminations. Therefore, we propose a novel termination with stubs in resistive film. This termination can disperse heat by resonating an input signal with open stubs. Hence, the proposed termination improved surface loss density by 50% compared to the conventional one. In addition, we show that the fabricated termination has the reflection coefficient characteristics smaller than-20B in the bandwidth of 43.3%.
KW - broadband
KW - high-power capability
KW - resistive film
KW - stub
KW - termination
UR - http://www.scopus.com/inward/record.url?scp=85096616502&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85096616502&partnerID=8YFLogxK
U2 - 10.1109/RFIT49453.2020.9226207
DO - 10.1109/RFIT49453.2020.9226207
M3 - Conference contribution
AN - SCOPUS:85096616502
T3 - 2020 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2020
SP - 49
EP - 51
BT - 2020 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2020 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2020
Y2 - 2 September 2020 through 4 September 2020
ER -