Thermal and Wirelength Optimization with TSV Assignment for 3-D-IC

Yi Zhao*, Cong Hao, Takeshi Yoshimura

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)


3-D-IC is an emerging technology that overcomes the drawbacks of 2-D-IC and a vital structure called through-silicon via (TSV) is used to connect the adjacent layers vertically. In this paper, based on graph theories, we formulate the TSV assignment as an integer multicommodity min-cost (IMCMC) problem, and using multilevel algorithm, we get optimal solution. During the assignment, the capacity of the grid could be insufficient to contain the flows so that conditional grid extension effectively relieves the capacity limits and accelerate running speed. Thermal resistive model is introduced to simulate the heat dissipation of chip and estimate temperature distribution each layer. By inserting the thermal TSV, the temperature of superheated region is reduced. Moreover, considering about a more complicated situation, we propose a method to assign multipins in a net. The experimental results demonstrate our model in the IMCMC network using multilevel algorithm achieve optimized congestion, less wirelength, higher running speed, and reduced temperature.

Original languageEnglish
Article number8523818
Pages (from-to)625-632
Number of pages8
JournalIEEE Transactions on Electron Devices
Issue number1
Publication statusPublished - 2019 Jan 1


  • 3-D-IC
  • thermal through silicon-via (TSV)
  • TSV assignment

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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