Fingerprint
Dive into the research topics of 'Thermal bond reliability of high reliability gold alloy wires for automotive IC's'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Thermal bond reliability of high reliability gold alloy wires for automotive IC's
Tomohiro Uno*, Keiichi Kimura, Kohei Tatsumi
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
6
Citations
(Scopus)