Thermal resistance and transient thermal analysis of sic power module using ni micro plating bonding

Akihiro Imakiire; Masahiro Kozako; Masayuki Hikita; Kohei Tatsumi; Masakazu Inagaki; Tomonori Iizuka; Nobuaki Sato; Koji Shimizu; Kazutoshi Ueda; Kazuhiko Sugiura; Kazuhiro Tsuruta; Keiji Toda

doi:10.1541/ieejias.139.838

Thermal resistance and transient thermal analysis of sic power module using ni micro plating bonding

Akihiro Imakiire, Masahiro Kozako, Masayuki Hikita, Kohei Tatsumi, Masakazu Inagaki, Tomonori Iizuka, Nobuaki Sato, Koji Shimizu, Kazutoshi Ueda, Kazuhiko Sugiura, Kazuhiro Tsuruta, Keiji Toda

Graduate School of Information, Production and Systems

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

This paper deals with the thermal resistance and thermal conduction characteristics of a Nickel Micro Plating Bonding (NMPB) power module in comparison with those of a power module adapting a conventional structure with a high-temperature solder attachment. An attempt is made to estimate the thermal resistance and thermal structure function for the two types of power modules when peeling of the chip junction occurs. In terms of spreading heat, an NMPB is superior to a conventional power module using high temperature solder, because NMPB allows spreading heat from both sides of the chip and setting the heat spreader near the chip.

Original language	English
Pages (from-to)	838-846
Number of pages	9
Journal	ieej transactions on industry applications
Volume	139
Issue number	10
DOIs	https://doi.org/10.1541/ieejias.139.838
Publication status	Published - 2019

Keywords

Lead frame
Nickel micro plating bonding
Power module
Sic
Thermal resistance
Transient thermal analysis

ASJC Scopus subject areas

Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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10.1541/ieejias.139.838

Cite this

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title = "Thermal resistance and transient thermal analysis of sic power module using ni micro plating bonding",

abstract = "This paper deals with the thermal resistance and thermal conduction characteristics of a Nickel Micro Plating Bonding (NMPB) power module in comparison with those of a power module adapting a conventional structure with a high-temperature solder attachment. An attempt is made to estimate the thermal resistance and thermal structure function for the two types of power modules when peeling of the chip junction occurs. In terms of spreading heat, an NMPB is superior to a conventional power module using high temperature solder, because NMPB allows spreading heat from both sides of the chip and setting the heat spreader near the chip.",

keywords = "Lead frame, Nickel micro plating bonding, Power module, Sic, Thermal resistance, Transient thermal analysis",

author = "Akihiro Imakiire and Masahiro Kozako and Masayuki Hikita and Kohei Tatsumi and Masakazu Inagaki and Tomonori Iizuka and Nobuaki Sato and Koji Shimizu and Kazutoshi Ueda and Kazuhiko Sugiura and Kazuhiro Tsuruta and Keiji Toda",

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language = "English",

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T1 - Thermal resistance and transient thermal analysis of sic power module using ni micro plating bonding

AU - Imakiire, Akihiro

AU - Kozako, Masahiro

AU - Hikita, Masayuki

AU - Tatsumi, Kohei

AU - Inagaki, Masakazu

AU - Iizuka, Tomonori

AU - Sato, Nobuaki

AU - Shimizu, Koji

AU - Ueda, Kazutoshi

AU - Sugiura, Kazuhiko

AU - Tsuruta, Kazuhiro

AU - Toda, Keiji

PY - 2019

Y1 - 2019

N2 - This paper deals with the thermal resistance and thermal conduction characteristics of a Nickel Micro Plating Bonding (NMPB) power module in comparison with those of a power module adapting a conventional structure with a high-temperature solder attachment. An attempt is made to estimate the thermal resistance and thermal structure function for the two types of power modules when peeling of the chip junction occurs. In terms of spreading heat, an NMPB is superior to a conventional power module using high temperature solder, because NMPB allows spreading heat from both sides of the chip and setting the heat spreader near the chip.

AB - This paper deals with the thermal resistance and thermal conduction characteristics of a Nickel Micro Plating Bonding (NMPB) power module in comparison with those of a power module adapting a conventional structure with a high-temperature solder attachment. An attempt is made to estimate the thermal resistance and thermal structure function for the two types of power modules when peeling of the chip junction occurs. In terms of spreading heat, an NMPB is superior to a conventional power module using high temperature solder, because NMPB allows spreading heat from both sides of the chip and setting the heat spreader near the chip.

KW - Lead frame

KW - Nickel micro plating bonding

KW - Power module

KW - Sic

KW - Thermal resistance

KW - Transient thermal analysis

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Thermal resistance and transient thermal analysis of sic power module using ni micro plating bonding

Abstract

Keywords

ASJC Scopus subject areas

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