THERMAL STABILITY OF ELECTROLESS NICKEL-TUNGSTEN-PHOSPHORUS ALLOY FILMS.

Hideo Sawai; Takashi Kanamori; Susumu Shibata; Kohji Nihei; Tetsuya Osaka; Ichiro Koiwa; Masao Nishikawa

THERMAL STABILITY OF ELECTROLESS NICKEL-TUNGSTEN-PHOSPHORUS ALLOY FILMS.

Hideo Sawai^*, Takashi Kanamori, Susumu Shibata, Kohji Nihei, Tetsuya Osaka, Ichiro Koiwa, Masao Nishikawa

^*Corresponding author for this work

Research output: Contribution to conference › Paper › peer-review

7 Citations (Scopus)

Abstract

The thermal stability of the resistivity of electroless Ni-W-P films was investigated for applications to thin film resistors. The tungsten codeposition into Ni-P films greatly improved the thermal stability and uniformity of electric resistivity of films.

Original language	English
Pages	323-328
Number of pages	6
Publication status	Published - 1984 Dec 1
Externally published	Yes

ASJC Scopus subject areas

Engineering(all)

Cite this

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title = "THERMAL STABILITY OF ELECTROLESS NICKEL-TUNGSTEN-PHOSPHORUS ALLOY FILMS.",

abstract = "The thermal stability of the resistivity of electroless Ni-W-P films was investigated for applications to thin film resistors. The tungsten codeposition into Ni-P films greatly improved the thermal stability and uniformity of electric resistivity of films.",

author = "Hideo Sawai and Takashi Kanamori and Susumu Shibata and Kohji Nihei and Tetsuya Osaka and Ichiro Koiwa and Masao Nishikawa",

year = "1984",

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language = "English",

pages = "323--328",

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T1 - THERMAL STABILITY OF ELECTROLESS NICKEL-TUNGSTEN-PHOSPHORUS ALLOY FILMS.

AU - Sawai, Hideo

AU - Kanamori, Takashi

AU - Shibata, Susumu

AU - Nihei, Kohji

AU - Osaka, Tetsuya

AU - Koiwa, Ichiro

AU - Nishikawa, Masao

PY - 1984/12/1

Y1 - 1984/12/1

N2 - The thermal stability of the resistivity of electroless Ni-W-P films was investigated for applications to thin film resistors. The tungsten codeposition into Ni-P films greatly improved the thermal stability and uniformity of electric resistivity of films.

AB - The thermal stability of the resistivity of electroless Ni-W-P films was investigated for applications to thin film resistors. The tungsten codeposition into Ni-P films greatly improved the thermal stability and uniformity of electric resistivity of films.

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UR - http://www.scopus.com/inward/citedby.url?scp=0021665157&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0021665157

SP - 323

EP - 328

ER -

THERMAL STABILITY OF ELECTROLESS NICKEL-TUNGSTEN-PHOSPHORUS ALLOY FILMS.

Abstract

ASJC Scopus subject areas

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