Thermally induced photoluminescence quenching centre in hydrogenated amorphous silicon oxynitride

Hiromitsu Kato*, Akira Masuzawa, Takashi Noma, Kwang Soo Seol, Yoshimichi Ohki

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

19 Citations (Scopus)


The effect of thermal annealing on the photoluminescence around 2.2-2.9 eV in hydrogenated amorphous silicon oxynitride films was investigated. The luminescence intensity increases monotonically with an increase in the annealing temperature for the samples with lower nitrogen contents (N/O = 0.06, 0.10 and 0.12). It shows a similar increase up to 500°C, while it decreases abruptly above 500°C for the samples with higher nitrogen contents (N/O = 0.14 and 0.18). The density of silicon dangling bonds depends on the annealing temperature in a manner opposite to that of the luminescence intensity in all the temperature region. Based on this correlation, it is thought that the silicon dangling bonds act as the quenching centre. Infrared absorption spectroscopy indicated that the precursor of silicon dangling bonds was the Si-H bond. Hydrogen was released at temperatures above 500°C from Si-H bonds, resulting in a large number of silicon dangling bonds that quench the luminescence.

Original languageEnglish
Pages (from-to)6541-6549
Number of pages9
JournalJournal of Physics Condensed Matter
Issue number30
Publication statusPublished - 2001 Jul 30

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics


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