Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model

Rui Zhang; Hongbin Shi; Yuehong Dai; Jong Tae Park; Toshitsugu Ueda

doi:10.1016/j.microrel.2012.06.084

Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model

Rui Zhang^*, Hongbin Shi, Yuehong Dai, Jong Tae Park, Toshitsugu Ueda

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

Abstract

This paper presents the investigation of the thermal mechanical reliability of a hydrogen gas sensor using MEMS-based quartz resonator by finite element analysis (FEA). The hydrogen gas senor has an internal heat source when in operating, the quartz resonator may subjected to thermal stress due to the thermal expansion coefficients (CTE) mismatch between the resonator and the LTCC package. This could cause cracks on the resonator and finally lead to failure of the sensor. Both thermal and thermo-mechanical simulations of a 3D model of the sensor were built using ANSYS software. Higher thermal mechanical stress level was found in the resonator based on the FEA, which is consistent with the results of verified experiments. Some optimal design was also carried out to improve the thermal reliability of the resonator based on validated finite element model.

Original language	English
Pages (from-to)	2331-2335
Number of pages	5
Journal	Microelectronics Reliability
Volume	52
Issue number	9-10
DOIs	https://doi.org/10.1016/j.microrel.2012.06.084
Publication status	Published - 2012 Sept

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Surfaces, Coatings and Films
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Safety, Risk, Reliability and Quality

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10.1016/j.microrel.2012.06.084

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title = "Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model",

abstract = "This paper presents the investigation of the thermal mechanical reliability of a hydrogen gas sensor using MEMS-based quartz resonator by finite element analysis (FEA). The hydrogen gas senor has an internal heat source when in operating, the quartz resonator may subjected to thermal stress due to the thermal expansion coefficients (CTE) mismatch between the resonator and the LTCC package. This could cause cracks on the resonator and finally lead to failure of the sensor. Both thermal and thermo-mechanical simulations of a 3D model of the sensor were built using ANSYS software. Higher thermal mechanical stress level was found in the resonator based on the FEA, which is consistent with the results of verified experiments. Some optimal design was also carried out to improve the thermal reliability of the resonator based on validated finite element model.",

author = "Rui Zhang and Hongbin Shi and Yuehong Dai and Park, {Jong Tae} and Toshitsugu Ueda",

year = "2012",

month = sep,

doi = "10.1016/j.microrel.2012.06.084",

language = "English",

volume = "52",

pages = "2331--2335",

journal = "Microelectronics Reliability",

issn = "0026-2714",

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TY - JOUR

T1 - Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model

AU - Zhang, Rui

AU - Shi, Hongbin

AU - Dai, Yuehong

AU - Park, Jong Tae

AU - Ueda, Toshitsugu

PY - 2012/9

Y1 - 2012/9

N2 - This paper presents the investigation of the thermal mechanical reliability of a hydrogen gas sensor using MEMS-based quartz resonator by finite element analysis (FEA). The hydrogen gas senor has an internal heat source when in operating, the quartz resonator may subjected to thermal stress due to the thermal expansion coefficients (CTE) mismatch between the resonator and the LTCC package. This could cause cracks on the resonator and finally lead to failure of the sensor. Both thermal and thermo-mechanical simulations of a 3D model of the sensor were built using ANSYS software. Higher thermal mechanical stress level was found in the resonator based on the FEA, which is consistent with the results of verified experiments. Some optimal design was also carried out to improve the thermal reliability of the resonator based on validated finite element model.

AB - This paper presents the investigation of the thermal mechanical reliability of a hydrogen gas sensor using MEMS-based quartz resonator by finite element analysis (FEA). The hydrogen gas senor has an internal heat source when in operating, the quartz resonator may subjected to thermal stress due to the thermal expansion coefficients (CTE) mismatch between the resonator and the LTCC package. This could cause cracks on the resonator and finally lead to failure of the sensor. Both thermal and thermo-mechanical simulations of a 3D model of the sensor were built using ANSYS software. Higher thermal mechanical stress level was found in the resonator based on the FEA, which is consistent with the results of verified experiments. Some optimal design was also carried out to improve the thermal reliability of the resonator based on validated finite element model.

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JO - Microelectronics Reliability

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ER -

Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model

Abstract

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