Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond

Kenichi Oyaizu; Junya Katoh; Fumiaki Suzuki; Mitsutoshi Jikei; Kimihisa Yamamoto; Hiroyuki Nishide; Eishun Tsuchida

doi:10.1002/pat.1991.220020307

Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond

Kenichi Oyaizu^*, Junya Katoh, Fumiaki Suzuki, Mitsutoshi Jikei, Kimihisa Yamamoto, Hiroyuki Nishide, Eishun Tsuchida

^*Corresponding author for this work

School of Advanced Science and Engineering

Research output: Contribution to journal › Article › peer-review

7 Citations (Scopus)

Abstract

Oligo(phenylene sulfide) (OPS) containing one disulfide bond at the end of the chain, which was obtained by the oxidative polymerization of diphenyl disulfide, had a relatively low Td_10%(temperature for 10% weight loss) of 412 °C because of degradation of the disulfide bond. But this thermal cleavage of the disulfide bond promoted the curing reaction through thiophenoxy radical formation. OPS was allowed to react with diiodobenzene at 220 °C. The thermal stability of OPS was improved through the consumption of the disulfide bond and the coupling of the chain.

Original language	English
Pages (from-to)	155-159
Number of pages	5
Journal	Polymers for Advanced Technologies
Volume	2
Issue number	3
DOIs	https://doi.org/10.1002/pat.1991.220020307
Publication status	Published - 1991 Jun

Keywords

Disulfide
Oligo(phenylene sulfide)
Thermolysis

ASJC Scopus subject areas

Polymers and Plastics

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10.1002/pat.1991.220020307

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title = "Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond",

abstract = "Oligo(phenylene sulfide) (OPS) containing one disulfide bond at the end of the chain, which was obtained by the oxidative polymerization of diphenyl disulfide, had a relatively low Td10%(temperature for 10% weight loss) of 412 °C because of degradation of the disulfide bond. But this thermal cleavage of the disulfide bond promoted the curing reaction through thiophenoxy radical formation. OPS was allowed to react with diiodobenzene at 220 °C. The thermal stability of OPS was improved through the consumption of the disulfide bond and the coupling of the chain.",

keywords = "Disulfide, Oligo(phenylene sulfide), Thermolysis",

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T1 - Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond

AU - Oyaizu, Kenichi

AU - Katoh, Junya

AU - Suzuki, Fumiaki

AU - Jikei, Mitsutoshi

AU - Yamamoto, Kimihisa

AU - Nishide, Hiroyuki

AU - Tsuchida, Eishun

PY - 1991/6

Y1 - 1991/6

N2 - Oligo(phenylene sulfide) (OPS) containing one disulfide bond at the end of the chain, which was obtained by the oxidative polymerization of diphenyl disulfide, had a relatively low Td10%(temperature for 10% weight loss) of 412 °C because of degradation of the disulfide bond. But this thermal cleavage of the disulfide bond promoted the curing reaction through thiophenoxy radical formation. OPS was allowed to react with diiodobenzene at 220 °C. The thermal stability of OPS was improved through the consumption of the disulfide bond and the coupling of the chain.

AB - Oligo(phenylene sulfide) (OPS) containing one disulfide bond at the end of the chain, which was obtained by the oxidative polymerization of diphenyl disulfide, had a relatively low Td10%(temperature for 10% weight loss) of 412 °C because of degradation of the disulfide bond. But this thermal cleavage of the disulfide bond promoted the curing reaction through thiophenoxy radical formation. OPS was allowed to react with diiodobenzene at 220 °C. The thermal stability of OPS was improved through the consumption of the disulfide bond and the coupling of the chain.

KW - Disulfide

KW - Oligo(phenylene sulfide)

KW - Thermolysis

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Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond

Abstract

Keywords

ASJC Scopus subject areas

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