Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond

Kenichi Oyaizu*, Junya Katoh, Fumiaki Suzuki, Mitsutoshi Jikei, Kimihisa Yamamoto, Hiroyuki Nishide, Eishun Tsuchida

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)


Oligo(phenylene sulfide) (OPS) containing one disulfide bond at the end of the chain, which was obtained by the oxidative polymerization of diphenyl disulfide, had a relatively low Td10%(temperature for 10% weight loss) of 412 °C because of degradation of the disulfide bond. But this thermal cleavage of the disulfide bond promoted the curing reaction through thiophenoxy radical formation. OPS was allowed to react with diiodobenzene at 220 °C. The thermal stability of OPS was improved through the consumption of the disulfide bond and the coupling of the chain.

Original languageEnglish
Pages (from-to)155-159
Number of pages5
JournalPolymers for Advanced Technologies
Issue number3
Publication statusPublished - 1991 Jun


  • Disulfide
  • Oligo(phenylene sulfide)
  • Thermolysis

ASJC Scopus subject areas

  • Polymers and Plastics


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