TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing

Yi Zhao; Cong Hao; Takeshi Yoshimura

doi:10.1109/PATMOS.2018.8464161

TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing

Yi Zhao, Cong Hao, Takeshi Yoshimura

Graduate School of Information, Production and Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

The 3D integrated circuit is a complex structure composed of chips in multi-layers fabricated vertically and horizontally. Signal through-silicon-via (TSV) is vertical electric connection enabling to communicate and compact the functional bulk. And thermal TSV is effective to amplify the heat dissipation and reduce temperature by establishing the heat dissipation path. In this work we introduce conditional grid extension method to Integrated Multi-Commodity Min-Cost (IMCMC) problem to relieve capacity limit. Moreover, we propose thermal increase model to simulate thermal distribution and realize temperature reduction. Compared with previous work, several routing revision is adopted to make the result more accurate and reduce wire capacitance. The experimental results show the effectiveness of our algorithm on reducing temperature and optimizing congestion.

Original language	English
Title of host publication	2018 IEEE 28th International Symposium on Power and Timing Modeling, Optimization and Simulation, PATMOS 2018
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	155-162
Number of pages	8
ISBN (Print)	9781538663653
DOIs	https://doi.org/10.1109/PATMOS.2018.8464161
Publication status	Published - 2018 Sept 12
Event	28th IEEE International Symposium on Power and Timing Modeling, Optimization and Simulation, PATMOS 2018 - Platja d'Aro, Spain Duration: 2018 Jul 2 → 2018 Jul 4

Other

Other	28th IEEE International Symposium on Power and Timing Modeling, Optimization and Simulation, PATMOS 2018
Country/Territory	Spain
City	Platja d'Aro
Period	18/7/2 → 18/7/4

Keywords

3D-IC
thermal TSV
TSV assignment

ASJC Scopus subject areas

Control and Optimization
Energy Engineering and Power Technology
Electrical and Electronic Engineering
Modelling and Simulation

Access to Document

10.1109/PATMOS.2018.8464161

Cite this

TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing. / Zhao, Yi; Hao, Cong; Yoshimura, Takeshi.
2018 IEEE 28th International Symposium on Power and Timing Modeling, Optimization and Simulation, PATMOS 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 155-162 8464161.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Zhao, Y, Hao, C & Yoshimura, T 2018, TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing. in 2018 IEEE 28th International Symposium on Power and Timing Modeling, Optimization and Simulation, PATMOS 2018., 8464161, Institute of Electrical and Electronics Engineers Inc., pp. 155-162, 28th IEEE International Symposium on Power and Timing Modeling, Optimization and Simulation, PATMOS 2018, Platja d'Aro, Spain, 18/7/2. https://doi.org/10.1109/PATMOS.2018.8464161

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abstract = "The 3D integrated circuit is a complex structure composed of chips in multi-layers fabricated vertically and horizontally. Signal through-silicon-via (TSV) is vertical electric connection enabling to communicate and compact the functional bulk. And thermal TSV is effective to amplify the heat dissipation and reduce temperature by establishing the heat dissipation path. In this work we introduce conditional grid extension method to Integrated Multi-Commodity Min-Cost (IMCMC) problem to relieve capacity limit. Moreover, we propose thermal increase model to simulate thermal distribution and realize temperature reduction. Compared with previous work, several routing revision is adopted to make the result more accurate and reduce wire capacitance. The experimental results show the effectiveness of our algorithm on reducing temperature and optimizing congestion.",

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AB - The 3D integrated circuit is a complex structure composed of chips in multi-layers fabricated vertically and horizontally. Signal through-silicon-via (TSV) is vertical electric connection enabling to communicate and compact the functional bulk. And thermal TSV is effective to amplify the heat dissipation and reduce temperature by establishing the heat dissipation path. In this work we introduce conditional grid extension method to Integrated Multi-Commodity Min-Cost (IMCMC) problem to relieve capacity limit. Moreover, we propose thermal increase model to simulate thermal distribution and realize temperature reduction. Compared with previous work, several routing revision is adopted to make the result more accurate and reduce wire capacitance. The experimental results show the effectiveness of our algorithm on reducing temperature and optimizing congestion.

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TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing

Abstract

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Keywords

ASJC Scopus subject areas

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