TY - GEN
T1 - Two methods for improving electrochemical migration resistance of printed wiring boards
AU - Ohki, Y.
AU - Hirose, Y.
AU - Wada, G.
AU - Asakawa, H.
AU - Tanaka, T.
AU - Maeno, T.
AU - Okamoto, K.
PY - 2012/12/31
Y1 - 2012/12/31
N2 - Experiments were carried out using space charge distribution measurements as a major measurement method in order to find effective measures to suppress electrochemical migration (ECM) along the thickness direction of a printed wiring board (PWB). As a result, the following valuable knowledge was obtained. First, in a PWB consisting of paper/ phenol-resin composite and a copper electrode, the electrical resistivity of epoxy resin used as an adhesive layer to connect the composite and the electrode is usually higher than that of the composite. In such a case, ECM is easily grown in the PWB. The resistance against ECM was found to increase significantly if we use an adhesive layer with a similar electrical resistivity to the insulating material in a PWB. Another important fact is that the growth of ECM can be suppressed if silica nanofillers were added to epoxy resin in the case of an epoxy-based PWB.
AB - Experiments were carried out using space charge distribution measurements as a major measurement method in order to find effective measures to suppress electrochemical migration (ECM) along the thickness direction of a printed wiring board (PWB). As a result, the following valuable knowledge was obtained. First, in a PWB consisting of paper/ phenol-resin composite and a copper electrode, the electrical resistivity of epoxy resin used as an adhesive layer to connect the composite and the electrode is usually higher than that of the composite. In such a case, ECM is easily grown in the PWB. The resistance against ECM was found to increase significantly if we use an adhesive layer with a similar electrical resistivity to the insulating material in a PWB. Another important fact is that the growth of ECM can be suppressed if silica nanofillers were added to epoxy resin in the case of an epoxy-based PWB.
KW - electrochemical migration
KW - printed wiring board
UR - http://www.scopus.com/inward/record.url?scp=84871588351&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84871588351&partnerID=8YFLogxK
U2 - 10.1109/ICHVE.2012.6357042
DO - 10.1109/ICHVE.2012.6357042
M3 - Conference contribution
AN - SCOPUS:84871588351
SN - 9781467347464
T3 - ICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application
SP - 548
EP - 552
BT - ICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application
T2 - 2012 International Conference on High Voltage Engineering and Application, ICHVE 2012
Y2 - 17 September 2012 through 20 September 2012
ER -