Ultra-high-speed and low-power SOI CMOS technology with body-tied hybrid trench isolation structure

Yuuichi Hirano*, Takashi Ipposhi, Dang Hai Thai, Toshiaki Iwamatsu, Tatsuhiko Ikeda, Mikio Tsujiuchi, Shigeto Maegawa, Masahide Inuishi, Yuzuru Ohji

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

1 Citation (Scopus)

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Engineering & Materials Science